Laser thermal processing of group IV semiconductors for integrated photonic systems

Abstract

In the quest to expand the functionality and capacity of group IV semiconductor photonic systems, new materials and production methods are constantly being explored. In particular, flexible fabrication and post‐processing approaches that are compatible with different materials and allow for tuning of the components and systems are of great interest. Within this research area, laser thermal processing has emerged as an indispensable tool that can be applied to enhance and/or modify the material, structural, electrical and optical properties of group IV elemental and compound semiconductors at various stages of the production process. This review evaluates the recent progress made in the application of laser processing techniques to develop integrated semiconductor systems in both fiber and planar‐based platforms. Laser processing has allowed for the production of semiconductor waveguides with high crystallinity in the core and low optical losses, as well as post‐fabrication trimming of device characteristics and direct writing of tunable strain and composition profiles for bandgap engineering and optical waveguiding. For each platform, the current challenges and opportunities for the future development of laser‐processed integrated semiconductor photonic systems are presented.

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Identifiers

ORCID for Ozan Aktaş: orcid.org/0000-0002-2255-7761

ORCID for Anna Peacock: orcid.org/0000-0002-1940-7172

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