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Laser thermal processing of group IV semiconductors for integrated photonic systems

Laser thermal processing of group IV semiconductors for integrated photonic systems
Laser thermal processing of group IV semiconductors for integrated photonic systems
In the quest to expand the functionality and capacity of group IV semiconductor photonic systems, new materials and production methods are constantly being explored. In particular, flexible fabrication and post‐processing approaches that are compatible with different materials and allow for tuning of the components and systems are of great interest. Within this research area, laser thermal processing has emerged as an indispensable tool that can be applied to enhance and/or modify the material, structural, electrical and optical properties of group IV elemental and compound semiconductors at various stages of the production process. This review evaluates the recent progress made in the application of laser processing techniques to develop integrated semiconductor systems in both fiber and planar‐based platforms. Laser processing has allowed for the production of semiconductor waveguides with high crystallinity in the core and low optical losses, as well as post‐fabrication trimming of device characteristics and direct writing of tunable strain and composition profiles for bandgap engineering and optical waveguiding. For each platform, the current challenges and opportunities for the future development of laser‐processed integrated semiconductor photonic systems are presented.
2699-9293
Aktaş, Ozan
2e90db41-f409-431f-9827-2e2577a52457
Peacock, Anna
685d924c-ef6b-401b-a0bd-acf1f8e758fc
Aktaş, Ozan
2e90db41-f409-431f-9827-2e2577a52457
Peacock, Anna
685d924c-ef6b-401b-a0bd-acf1f8e758fc

Aktaş, Ozan and Peacock, Anna (2021) Laser thermal processing of group IV semiconductors for integrated photonic systems. Advanced Photonics Research. (doi:10.1002/adpr.202000159).

Record type: Review

Abstract

In the quest to expand the functionality and capacity of group IV semiconductor photonic systems, new materials and production methods are constantly being explored. In particular, flexible fabrication and post‐processing approaches that are compatible with different materials and allow for tuning of the components and systems are of great interest. Within this research area, laser thermal processing has emerged as an indispensable tool that can be applied to enhance and/or modify the material, structural, electrical and optical properties of group IV elemental and compound semiconductors at various stages of the production process. This review evaluates the recent progress made in the application of laser processing techniques to develop integrated semiconductor systems in both fiber and planar‐based platforms. Laser processing has allowed for the production of semiconductor waveguides with high crystallinity in the core and low optical losses, as well as post‐fabrication trimming of device characteristics and direct writing of tunable strain and composition profiles for bandgap engineering and optical waveguiding. For each platform, the current challenges and opportunities for the future development of laser‐processed integrated semiconductor photonic systems are presented.

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Accepted/In Press date: 5 March 2021
e-pub ahead of print date: 6 March 2021
Published date: 6 March 2021

Identifiers

Local EPrints ID: 448108
URI: http://eprints.soton.ac.uk/id/eprint/448108
ISSN: 2699-9293
PURE UUID: 7307501a-8889-4b96-aff2-bd8177880e99
ORCID for Ozan Aktaş: ORCID iD orcid.org/0000-0002-2255-7761
ORCID for Anna Peacock: ORCID iD orcid.org/0000-0002-1940-7172

Catalogue record

Date deposited: 01 Apr 2021 15:59
Last modified: 17 Mar 2024 02:56

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Contributors

Author: Ozan Aktaş ORCID iD
Author: Anna Peacock ORCID iD

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