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Enhanced boron nitride/polyolefin blends for high voltage applications

Enhanced boron nitride/polyolefin blends for high voltage applications
Enhanced boron nitride/polyolefin blends for high voltage applications
The effect of improved exfoliation on the electrical properties of hexagonal boron nitride (h-BN) composites based on polyethylene and polypropylene was studied. Chemical and thermal treatments were used to obtain exfoliated h-BN which was initially added to the host polymer at 2 wt. %. Scanning electron microscopy was used to study the particle dispersion, whilst measurements of AC breakdown strength and electrical conductivity were used to assess dielectric performance. It was found that an acid/hydrogen peroxide method was effective at exfoliating h-BN as evinced by an absence of large micron-scale aggregates in electron micrographs. A 20 % increase in AC breakdown strength and a factor of 5 decrease in the electrical conductivity was attained relative to the unfilled host polymer.
Composites employing exfoliated h-BN were then compared to analogous systems employing untreated h-BN over a wide compositional range. Whilst there was some advantage in incorporating untreated h-BN over the properties of the unfilled host polymer, the use of treated h-BN allowed maximum AC breakdown strength to be obtained at much lower filler loadings (~2 %) than hitherto reported. This allows a much smaller h-BN loading to be used for enhanced dielectric properties, reducing manufacturing costs. In addition, at high filler loadings, the thermal conductivity could be usefully improved. Such enhanced materials could be deployed in high voltage cables and capacitors.
Boron, Boron Nitride, Conductivity, Electric breakdown, Electrical breakdown strength, Exfoliation, Heating systems, Loading, Polyethylene, Powders, Surface treatment
1941-0085
794 - 802
Hosier, Ian
6a44329e-b742-44de-afa7-073f80a78e26
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Vaughan, Alun
6d813b66-17f9-4864-9763-25a6d659d8a3
Stevens, Gary
dfa215fc-7051-433c-8738-ffbc9b65272f
McAllister, Nicky
1cd558fc-86f6-4cac-a5d3-9966805228c5
Basu, Susmit
981dd0d6-318a-4320-8a52-d2546353c781
German, Ian
872bf15f-4303-45ef-8d03-01ffa0b02cb3
Hosier, Ian
6a44329e-b742-44de-afa7-073f80a78e26
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Vaughan, Alun
6d813b66-17f9-4864-9763-25a6d659d8a3
Stevens, Gary
dfa215fc-7051-433c-8738-ffbc9b65272f
McAllister, Nicky
1cd558fc-86f6-4cac-a5d3-9966805228c5
Basu, Susmit
981dd0d6-318a-4320-8a52-d2546353c781
German, Ian
872bf15f-4303-45ef-8d03-01ffa0b02cb3

Hosier, Ian, Andritsch, Thomas, Vaughan, Alun, Stevens, Gary, McAllister, Nicky, Basu, Susmit and German, Ian (2021) Enhanced boron nitride/polyolefin blends for high voltage applications. IEEE Transactions on Nanotechnology, 20, 794 - 802. (doi:10.1109/TNANO.2021.3120147).

Record type: Article

Abstract

The effect of improved exfoliation on the electrical properties of hexagonal boron nitride (h-BN) composites based on polyethylene and polypropylene was studied. Chemical and thermal treatments were used to obtain exfoliated h-BN which was initially added to the host polymer at 2 wt. %. Scanning electron microscopy was used to study the particle dispersion, whilst measurements of AC breakdown strength and electrical conductivity were used to assess dielectric performance. It was found that an acid/hydrogen peroxide method was effective at exfoliating h-BN as evinced by an absence of large micron-scale aggregates in electron micrographs. A 20 % increase in AC breakdown strength and a factor of 5 decrease in the electrical conductivity was attained relative to the unfilled host polymer.
Composites employing exfoliated h-BN were then compared to analogous systems employing untreated h-BN over a wide compositional range. Whilst there was some advantage in incorporating untreated h-BN over the properties of the unfilled host polymer, the use of treated h-BN allowed maximum AC breakdown strength to be obtained at much lower filler loadings (~2 %) than hitherto reported. This allows a much smaller h-BN loading to be used for enhanced dielectric properties, reducing manufacturing costs. In addition, at high filler loadings, the thermal conductivity could be usefully improved. Such enhanced materials could be deployed in high voltage cables and capacitors.

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EnhancedBN-v11-TNANO
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Accepted/In Press date: 2021
e-pub ahead of print date: 15 October 2021
Published date: 5 November 2021
Additional Information: Publisher Copyright: IEEE Copyright: Copyright 2021 Elsevier B.V., All rights reserved.
Keywords: Boron, Boron Nitride, Conductivity, Electric breakdown, Electrical breakdown strength, Exfoliation, Heating systems, Loading, Polyethylene, Powders, Surface treatment

Identifiers

Local EPrints ID: 452078
URI: http://eprints.soton.ac.uk/id/eprint/452078
ISSN: 1941-0085
PURE UUID: 3affb449-efd9-44c8-ab54-1bfeb1beeb7d
ORCID for Ian Hosier: ORCID iD orcid.org/0000-0003-4365-9385
ORCID for Thomas Andritsch: ORCID iD orcid.org/0000-0002-3462-022X
ORCID for Alun Vaughan: ORCID iD orcid.org/0000-0002-0535-513X

Catalogue record

Date deposited: 11 Nov 2021 17:31
Last modified: 24 Nov 2021 02:44

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Contributors

Author: Ian Hosier ORCID iD
Author: Thomas Andritsch ORCID iD
Author: Alun Vaughan ORCID iD
Author: Gary Stevens
Author: Nicky McAllister
Author: Susmit Basu
Author: Ian German

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