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Dynamic sustainable polyimide film combining hardness with softness via a “Mimosa-Like” bionic strategy

Dynamic sustainable polyimide film combining hardness with softness via a “Mimosa-Like” bionic strategy
Dynamic sustainable polyimide film combining hardness with softness via a “Mimosa-Like” bionic strategy

Dielectric polyimides (PIs) are ubiquitous as insulation in electrical power systems and electronic devices. Generally, dynamic polyimide is required to solve irreversible failure processes of electrical or mechanical damage, for example, under high temperature, pressure, and field strength. The challenge lies in the design of the molecular structure of rigid polyimide to achieve dynamic reversibility. Herein, a low-molecular-weight polyimide gene unit is designed to crosslink with polyimide ligase to prepare the smart film. Interestingly, due to the variability of gene unit and ligase combinations, the polyimide films combining hardness with softness are designed into three forms via a “Mimosa-like” bionic strategy to adapt to different application scenarios. Meanwhile, the films have good degradation efficiency, excellent recyclability, and can be self-healable, which makes them reuse. Clearly, the films can be used in the preparation of ultrafast sensors with a response time ≈0.15 s and the application of corona-resistant films with 100% recovery. Furthermore, the construction of polyimide and carbon-fiber-reinforced composites (CFRCs) has been verified to apply to the worse environment. Nicely, the composites have the property of multiple cycles and the non-destructive recycle rate of carbon fiber (CF) is as high as 100%. The design idea of preparing high-strength dynamic polyimide by crosslinking simple polyimide gene unit with ligase could provide a good foundation and a clear case for the sustainable development of electrical and electronic polyimides, from the perspective of Mimosa bionics.

bionics, carbon fibers, polyimide, recyclability, self-healable materials
1521-4095
Chen, George
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Wan, Baoquan
13921996-cc00-4822-80a2-b7aa9edc5023
Yang, Xing
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Dong, Xiaodi
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Zheng, Ming-Sheng
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Zhao, Quanliang
62538551-e9c7-40a2-a4fd-6e03c2b6ee30
Zhang, Hongkuan
1d4431b1-539b-4cdc-9e9c-a7489c01eb65
Zha, Jun_Wei
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Chen, George
3de45a9c-6c9a-4bcb-90c3-d7e26be21819
Wan, Baoquan
13921996-cc00-4822-80a2-b7aa9edc5023
Yang, Xing
25f8e8e3-69dc-44e2-a730-fcfa6414d36e
Dong, Xiaodi
77e21d12-2a07-4835-ad25-1d07488ecef0
Zheng, Ming-Sheng
cfdcd2c1-fc1e-46b8-b556-973222e21fc2
Zhao, Quanliang
62538551-e9c7-40a2-a4fd-6e03c2b6ee30
Zhang, Hongkuan
1d4431b1-539b-4cdc-9e9c-a7489c01eb65
Zha, Jun_Wei
9d344031-3293-4851-b52f-5aec6fceb2f4

Chen, George, Wan, Baoquan, Yang, Xing, Dong, Xiaodi, Zheng, Ming-Sheng, Zhao, Quanliang, Zhang, Hongkuan and Zha, Jun_Wei (2022) Dynamic sustainable polyimide film combining hardness with softness via a “Mimosa-Like” bionic strategy. Advanced Materials, [202207451]. (doi:10.1002/adma.202207451).

Record type: Article

Abstract

Dielectric polyimides (PIs) are ubiquitous as insulation in electrical power systems and electronic devices. Generally, dynamic polyimide is required to solve irreversible failure processes of electrical or mechanical damage, for example, under high temperature, pressure, and field strength. The challenge lies in the design of the molecular structure of rigid polyimide to achieve dynamic reversibility. Herein, a low-molecular-weight polyimide gene unit is designed to crosslink with polyimide ligase to prepare the smart film. Interestingly, due to the variability of gene unit and ligase combinations, the polyimide films combining hardness with softness are designed into three forms via a “Mimosa-like” bionic strategy to adapt to different application scenarios. Meanwhile, the films have good degradation efficiency, excellent recyclability, and can be self-healable, which makes them reuse. Clearly, the films can be used in the preparation of ultrafast sensors with a response time ≈0.15 s and the application of corona-resistant films with 100% recovery. Furthermore, the construction of polyimide and carbon-fiber-reinforced composites (CFRCs) has been verified to apply to the worse environment. Nicely, the composites have the property of multiple cycles and the non-destructive recycle rate of carbon fiber (CF) is as high as 100%. The design idea of preparing high-strength dynamic polyimide by crosslinking simple polyimide gene unit with ligase could provide a good foundation and a clear case for the sustainable development of electrical and electronic polyimides, from the perspective of Mimosa bionics.

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Accepted/In Press date: 16 August 2022
e-pub ahead of print date: 25 October 2022
Additional Information: Funding Information: This work was financially supported by the National Natural Science Foundation of China (No. 51977114) and the Scientific and Technological Innovation Foundation of Foshan (BK21BE006).
Keywords: bionics, carbon fibers, polyimide, recyclability, self-healable materials

Identifiers

Local EPrints ID: 473176
URI: http://eprints.soton.ac.uk/id/eprint/473176
ISSN: 1521-4095
PURE UUID: ea328673-300d-4e6c-8ee7-838e07d41254

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Date deposited: 11 Jan 2023 17:53
Last modified: 06 Jun 2024 04:07

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Contributors

Author: George Chen
Author: Baoquan Wan
Author: Xing Yang
Author: Xiaodi Dong
Author: Ming-Sheng Zheng
Author: Quanliang Zhao
Author: Hongkuan Zhang
Author: Jun_Wei Zha

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