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Interleaved angled MMI CWDM structure on the SOI platform

Interleaved angled MMI CWDM structure on the SOI platform
Interleaved angled MMI CWDM structure on the SOI platform

We have demonstrated a low-insertion-loss 8-channel interleaved angled MMI CWDM structure on the SOI platform. It requires only a single-step lithography and etching for fabrication and has good tolerance to fabrication errors.

1949-2081
21-22
Hu, Y.
38fe48b3-1609-4834-ad54-dc823e3a98b3
Gardes, F. Y.
7a49fc6d-dade-4099-b016-c60737cb5bb2
Thomson, D. J.
17c1626c-2422-42c6-98e0-586ae220bcda
Mashanovich, G. Z.
c806e262-af80-4836-b96f-319425060051
Reed, G. T.
ca08dd60-c072-4d7d-b254-75714d570139
Hu, Y.
38fe48b3-1609-4834-ad54-dc823e3a98b3
Gardes, F. Y.
7a49fc6d-dade-4099-b016-c60737cb5bb2
Thomson, D. J.
17c1626c-2422-42c6-98e0-586ae220bcda
Mashanovich, G. Z.
c806e262-af80-4836-b96f-319425060051
Reed, G. T.
ca08dd60-c072-4d7d-b254-75714d570139

Hu, Y., Gardes, F. Y., Thomson, D. J., Mashanovich, G. Z. and Reed, G. T. (2013) Interleaved angled MMI CWDM structure on the SOI platform. In 2013 IEEE 10th International Conference on Group IV Photonics, GFP 2013. pp. 21-22 . (doi:10.1109/Group4.2013.6644470).

Record type: Conference or Workshop Item (Paper)

Abstract

We have demonstrated a low-insertion-loss 8-channel interleaved angled MMI CWDM structure on the SOI platform. It requires only a single-step lithography and etching for fabrication and has good tolerance to fabrication errors.

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More information

Published date: 30 August 2013
Venue - Dates: 2013 IEEE 10th International Conference on Group IV Photonics, GFP 2013, , Seoul, Korea, Republic of, 2013-08-28 - 2013-08-30

Identifiers

Local EPrints ID: 478978
URI: http://eprints.soton.ac.uk/id/eprint/478978
ISSN: 1949-2081
PURE UUID: a2e92478-28ce-4e9d-a930-441ec57cf569
ORCID for F. Y. Gardes: ORCID iD orcid.org/0000-0003-1400-3272

Catalogue record

Date deposited: 17 Jul 2023 16:34
Last modified: 17 Mar 2024 03:26

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Contributors

Author: Y. Hu
Author: F. Y. Gardes ORCID iD
Author: D. J. Thomson
Author: G. T. Reed

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