Thermal conductivity of molten lead-free solders
Thermal conductivity of molten lead-free solders
The paper reports measurements of the thermal conductivity of a number of
molten solders for the electronics industry that are part of a group of materials
designed to be free of the toxic problems associated with lead-based
solders. The measurements have been carried out with a transient hot-wire
instrument originally designed for the measurement of the thermal conductivity
of pure molten metals. In the application reported here the instrument
has been used largely unchanged but an improved finite-element code has
been used for the analysis of the raw data so as to yield the thermal conductivity
of the molten solders. The measurements extend from the melting
point of the solder up to 625 K. The uncertainty in the thermal conductivity
measurements is estimated to be no larger than 3%.
lead free, molten solders, thermal conductivity, transient
hot-wire technique
92-102
Bilek, J
0aa7cbd4-ed49-4402-8b55-23cacc86f98f
Atkinson, J.K.
5e9729b2-0e1f-400d-a889-c74f6390ea58
Wakeham, W.A.
88549729-a39a-497f-b112-feaa6be2c449
January 2006
Bilek, J
0aa7cbd4-ed49-4402-8b55-23cacc86f98f
Atkinson, J.K.
5e9729b2-0e1f-400d-a889-c74f6390ea58
Wakeham, W.A.
88549729-a39a-497f-b112-feaa6be2c449
Bilek, J, Atkinson, J.K. and Wakeham, W.A.
(2006)
Thermal conductivity of molten lead-free solders.
International Journal of Thermophysics. Proceedings of the Fifteenth Symposium on Thermophysical Properties, Part II, 27 (1), .
(doi:10.1007/s10765-006-0035-4).
Abstract
The paper reports measurements of the thermal conductivity of a number of
molten solders for the electronics industry that are part of a group of materials
designed to be free of the toxic problems associated with lead-based
solders. The measurements have been carried out with a transient hot-wire
instrument originally designed for the measurement of the thermal conductivity
of pure molten metals. In the application reported here the instrument
has been used largely unchanged but an improved finite-element code has
been used for the analysis of the raw data so as to yield the thermal conductivity
of the molten solders. The measurements extend from the melting
point of the solder up to 625 K. The uncertainty in the thermal conductivity
measurements is estimated to be no larger than 3%.
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More information
Published date: January 2006
Keywords:
lead free, molten solders, thermal conductivity, transient
hot-wire technique
Identifiers
Local EPrints ID: 47902
URI: http://eprints.soton.ac.uk/id/eprint/47902
ISSN: 0195-928X
PURE UUID: 4282b1d5-5c6e-40dc-ba04-f3a1e754fdca
Catalogue record
Date deposited: 09 Aug 2007
Last modified: 16 Mar 2024 02:32
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Contributors
Author:
J Bilek
Author:
W.A. Wakeham
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