The University of Southampton
University of Southampton Institutional Repository

Thermal conductivity of molten lead-free solders

Thermal conductivity of molten lead-free solders
Thermal conductivity of molten lead-free solders
The paper reports measurements of the thermal conductivity of a number of molten solders for the electronics industry that are part of a group of materials designed to be free of the toxic problems associated with lead-based solders. The measurements have been carried out with a transient hot-wire instrument originally designed for the measurement of the thermal conductivity of pure molten metals. In the application reported here the instrument has been used largely unchanged but an improved finite-element code has been used for the analysis of the raw data so as to yield the thermal conductivity of the molten solders. The measurements extend from the melting point of the solder up to 625 K. The uncertainty in the thermal conductivity measurements is estimated to be no larger than 3%.
lead free, molten solders, thermal conductivity, transient hot-wire technique
0195-928X
92-102
Bilek, J
0aa7cbd4-ed49-4402-8b55-23cacc86f98f
Atkinson, J.K.
5e9729b2-0e1f-400d-a889-c74f6390ea58
Wakeham, W.A.
88549729-a39a-497f-b112-feaa6be2c449
Bilek, J
0aa7cbd4-ed49-4402-8b55-23cacc86f98f
Atkinson, J.K.
5e9729b2-0e1f-400d-a889-c74f6390ea58
Wakeham, W.A.
88549729-a39a-497f-b112-feaa6be2c449

Bilek, J, Atkinson, J.K. and Wakeham, W.A. (2006) Thermal conductivity of molten lead-free solders. International Journal of Thermophysics. Proceedings of the Fifteenth Symposium on Thermophysical Properties, Part II, 27 (1), 92-102. (doi:10.1007/s10765-006-0035-4).

Record type: Article

Abstract

The paper reports measurements of the thermal conductivity of a number of molten solders for the electronics industry that are part of a group of materials designed to be free of the toxic problems associated with lead-based solders. The measurements have been carried out with a transient hot-wire instrument originally designed for the measurement of the thermal conductivity of pure molten metals. In the application reported here the instrument has been used largely unchanged but an improved finite-element code has been used for the analysis of the raw data so as to yield the thermal conductivity of the molten solders. The measurements extend from the melting point of the solder up to 625 K. The uncertainty in the thermal conductivity measurements is estimated to be no larger than 3%.

This record has no associated files available for download.

More information

Published date: January 2006
Keywords: lead free, molten solders, thermal conductivity, transient hot-wire technique

Identifiers

Local EPrints ID: 47902
URI: http://eprints.soton.ac.uk/id/eprint/47902
ISSN: 0195-928X
PURE UUID: 4282b1d5-5c6e-40dc-ba04-f3a1e754fdca
ORCID for J.K. Atkinson: ORCID iD orcid.org/0000-0003-3411-8034

Catalogue record

Date deposited: 09 Aug 2007
Last modified: 16 Mar 2024 02:32

Export record

Altmetrics

Contributors

Author: J Bilek
Author: J.K. Atkinson ORCID iD
Author: W.A. Wakeham

Download statistics

Downloads from ePrints over the past year. Other digital versions may also be available to download e.g. from the publisher's website.

View more statistics

Atom RSS 1.0 RSS 2.0

Contact ePrints Soton: eprints@soton.ac.uk

ePrints Soton supports OAI 2.0 with a base URL of http://eprints.soton.ac.uk/cgi/oai2

This repository has been built using EPrints software, developed at the University of Southampton, but available to everyone to use.

We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we will assume that you are happy to receive cookies on the University of Southampton website.

×