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Thermal conductivity of molten lead-free solders

Thermal conductivity of molten lead-free solders
Thermal conductivity of molten lead-free solders
The paper reports measurements of the thermal conductivity of a number of molten solders for the electronics industry that are part of a group of materials designed to be free of the toxic problems associated with lead-based solders. The measurements have been carried out with a transient hot-wire instrument originally designed for the measurement of the thermal conductivity of pure molten metals. In the application reported here the instrument has been used largely unchanged but an improved finite-element code has been used for the analysis of the raw data so as to yield the thermal conductivity of the molten solders. The measurements extend from the melting point of the solder up to 625 K. The uncertainty in the thermal conductivity measurements is estimated to be no larger than 3%.
lead free, molten solders, thermal conductivity, transient hot-wire technique
0195-928X
92-102
Bilek, J
0aa7cbd4-ed49-4402-8b55-23cacc86f98f
Atkinson, J.K.
5e9729b2-0e1f-400d-a889-c74f6390ea58
Wakeham, W.A.
88549729-a39a-497f-b112-feaa6be2c449
Bilek, J
0aa7cbd4-ed49-4402-8b55-23cacc86f98f
Atkinson, J.K.
5e9729b2-0e1f-400d-a889-c74f6390ea58
Wakeham, W.A.
88549729-a39a-497f-b112-feaa6be2c449

Bilek, J, Atkinson, J.K. and Wakeham, W.A. (2006) Thermal conductivity of molten lead-free solders. International Journal of Thermophysics. Proceedings of the Fifteenth Symposium on Thermophysical Properties, Part II, 27 (1), 92-102. (doi:10.1007/s10765-006-0035-4).

Record type: Article

Abstract

The paper reports measurements of the thermal conductivity of a number of molten solders for the electronics industry that are part of a group of materials designed to be free of the toxic problems associated with lead-based solders. The measurements have been carried out with a transient hot-wire instrument originally designed for the measurement of the thermal conductivity of pure molten metals. In the application reported here the instrument has been used largely unchanged but an improved finite-element code has been used for the analysis of the raw data so as to yield the thermal conductivity of the molten solders. The measurements extend from the melting point of the solder up to 625 K. The uncertainty in the thermal conductivity measurements is estimated to be no larger than 3%.

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More information

Published date: January 2006
Keywords: lead free, molten solders, thermal conductivity, transient hot-wire technique

Identifiers

Local EPrints ID: 47902
URI: https://eprints.soton.ac.uk/id/eprint/47902
ISSN: 0195-928X
PURE UUID: 4282b1d5-5c6e-40dc-ba04-f3a1e754fdca
ORCID for J.K. Atkinson: ORCID iD orcid.org/0000-0003-3411-8034

Catalogue record

Date deposited: 09 Aug 2007
Last modified: 14 Mar 2019 01:57

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Contributors

Author: J Bilek
Author: J.K. Atkinson ORCID iD
Author: W.A. Wakeham

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