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Influence of bimetal interface confinement on the Hall-petch slope of multiscale Cu/Nb multilayer composites

Influence of bimetal interface confinement on the Hall-petch slope of multiscale Cu/Nb multilayer composites
Influence of bimetal interface confinement on the Hall-petch slope of multiscale Cu/Nb multilayer composites
Heterostructured materials afford a new way to improve the mechanical properties, which has become vital in both materials science and engineering applications. In the present research, Cu/Nb multilayer composites with layer thicknesses from the micrometer to nanometer were fabricated by accumulative roll bonding and the microstructure and mechanical properties of the Cu/Nb multilayer composites were then investigated. The yield strength and ultimate tensile strength of these composites increase with decreasing layer thickness. Moreover, the relationship between yield strength and (layer thickness)− 1/2 approximately accords with the conventional Hall-Petch equation but with a decrease in the Hall-Petch slope when the layer thickness decreases from the
micrometer to nanometer scales. The deformation microstructure of these Cu/Nb multilayer composites clearly exhibit dislocations glide in the layers, which reduces the stacking of dislocations at the Cu–Nb interface and thereby weakens the strengthening effect of the interface.
cu-nb, hall-petch relationship, interfaces, multilayer structures, tensile strength, Interfaces, Hall-petch relationship, Multilayer structures, Cu-Nb, Tensile strength
2405-8440
Ding, Chaogang
2edf8082-909e-4bec-a2b3-3b34943f5803
Xu, Jie
ff6d4656-c15b-45a4-bd71-d45937ec38fc
Shan, Debin
fd8652eb-1eeb-4ae2-bcc4-102320f3c2d7
Guo, Bin
f4dbe579-1803-49e4-99c0-cafa72c6a4c6
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
Ding, Chaogang
2edf8082-909e-4bec-a2b3-3b34943f5803
Xu, Jie
ff6d4656-c15b-45a4-bd71-d45937ec38fc
Shan, Debin
fd8652eb-1eeb-4ae2-bcc4-102320f3c2d7
Guo, Bin
f4dbe579-1803-49e4-99c0-cafa72c6a4c6
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86

Ding, Chaogang, Xu, Jie, Shan, Debin, Guo, Bin and Langdon, Terence G. (2023) Influence of bimetal interface confinement on the Hall-petch slope of multiscale Cu/Nb multilayer composites. Heliyon, 9 (5), [e16231]. (doi:10.1016/j.heliyon.2023.e16231).

Record type: Article

Abstract

Heterostructured materials afford a new way to improve the mechanical properties, which has become vital in both materials science and engineering applications. In the present research, Cu/Nb multilayer composites with layer thicknesses from the micrometer to nanometer were fabricated by accumulative roll bonding and the microstructure and mechanical properties of the Cu/Nb multilayer composites were then investigated. The yield strength and ultimate tensile strength of these composites increase with decreasing layer thickness. Moreover, the relationship between yield strength and (layer thickness)− 1/2 approximately accords with the conventional Hall-Petch equation but with a decrease in the Hall-Petch slope when the layer thickness decreases from the
micrometer to nanometer scales. The deformation microstructure of these Cu/Nb multilayer composites clearly exhibit dislocations glide in the layers, which reduces the stacking of dislocations at the Cu–Nb interface and thereby weakens the strengthening effect of the interface.

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Accepted/In Press date: 10 May 2023
e-pub ahead of print date: 12 May 2023
Published date: 21 May 2023
Additional Information: Funding Information: This work was supported by the National Natural Science Foundation of China under Grant No. 51635005 and the Program of Introducing Talents of Discipline to Universities under grant number B18017. Partial support was provided by the European Research Council under ERC Grant Agreement No. 267464-SPDMETALS (TGL). Publisher Copyright: © 2023
Keywords: cu-nb, hall-petch relationship, interfaces, multilayer structures, tensile strength, Interfaces, Hall-petch relationship, Multilayer structures, Cu-Nb, Tensile strength

Identifiers

Local EPrints ID: 482490
URI: http://eprints.soton.ac.uk/id/eprint/482490
ISSN: 2405-8440
PURE UUID: 8af55308-436c-473d-9796-d5d9adb247ce
ORCID for Terence G. Langdon: ORCID iD orcid.org/0000-0003-3541-9250

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Date deposited: 09 Oct 2023 16:44
Last modified: 18 Mar 2024 02:56

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Contributors

Author: Chaogang Ding
Author: Jie Xu
Author: Debin Shan
Author: Bin Guo

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