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An EBSD analysis of a commercial immiscible Cu43%Cr alloy after high-pressure torsion processing and annealing

An EBSD analysis of a commercial immiscible Cu43%Cr alloy after high-pressure torsion processing and annealing
An EBSD analysis of a commercial immiscible Cu43%Cr alloy after high-pressure torsion processing and annealing
The influence of high-pressure torsion (HPT) and annealing on microstructure, texture and thermal stability of an immiscible composite Cu43%Cr alloy was studied using electron backscatter diffraction, X-ray diffraction and microhardness measurements. As-received alloy samples were subjected to HPT and subsequent annealing treatment in the range of 210 to 850 °C for 1 hour in order to develop ultrafine-grained (UFG) microstructures and highlight their
thermal stability. The Cu and Cr grains were refined to ~0.45 and ~0.39 µm, respectively and exhibited equiaxed morphology. The crystallographic texture was of shear type in both Cu and Cr with the domination of C and F orientations, respectively. The UFG microstructure and texture were retained in the Cu43%Cr alloy up to 850 °C. The global results show that the immiscible composite Cu43%Cr alloy exhibits a high thermal stability up to 850°C. The evolution of the microstructure, texture and thermal stability of the UFG Cu43%Cr alloy was
compared to published data and available models.
CuCr alloy, high-pressure torsion, annealing, microstructure, texture, thermal stability
0141-8610
Bibimounea, I.
73fc0fe0-8029-487d-a726-57fe552d127a
Abib, K.
1e9e5520-b9fd-4aaa-bfed-8c871422f09c
Baudin, T.
66f20fda-0331-4990-8f10-f505d34f9bad
Brisset, F.
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Huang, Y.
9f4df815-51c1-4ee8-ad63-a92bf997103e
Bradai, D.
dfc10bba-9e86-4e1d-b8fe-17c109d5f9fd
Langdon, T.G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
Bibimounea, I.
73fc0fe0-8029-487d-a726-57fe552d127a
Abib, K.
1e9e5520-b9fd-4aaa-bfed-8c871422f09c
Baudin, T.
66f20fda-0331-4990-8f10-f505d34f9bad
Brisset, F.
4b6ffb1f-db13-4756-91c7-db9601b2e64e
Huang, Y.
9f4df815-51c1-4ee8-ad63-a92bf997103e
Bradai, D.
dfc10bba-9e86-4e1d-b8fe-17c109d5f9fd
Langdon, T.G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86

Bibimounea, I., Abib, K., Baudin, T., Brisset, F., Huang, Y., Bradai, D. and Langdon, T.G. (2023) An EBSD analysis of a commercial immiscible Cu43%Cr alloy after high-pressure torsion processing and annealing. Philosophical Magazine. (In Press)

Record type: Article

Abstract

The influence of high-pressure torsion (HPT) and annealing on microstructure, texture and thermal stability of an immiscible composite Cu43%Cr alloy was studied using electron backscatter diffraction, X-ray diffraction and microhardness measurements. As-received alloy samples were subjected to HPT and subsequent annealing treatment in the range of 210 to 850 °C for 1 hour in order to develop ultrafine-grained (UFG) microstructures and highlight their
thermal stability. The Cu and Cr grains were refined to ~0.45 and ~0.39 µm, respectively and exhibited equiaxed morphology. The crystallographic texture was of shear type in both Cu and Cr with the domination of C and F orientations, respectively. The UFG microstructure and texture were retained in the Cu43%Cr alloy up to 850 °C. The global results show that the immiscible composite Cu43%Cr alloy exhibits a high thermal stability up to 850°C. The evolution of the microstructure, texture and thermal stability of the UFG Cu43%Cr alloy was
compared to published data and available models.

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Bibimoune_Phil Magazine_Accepted - Accepted Manuscript
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Accepted/In Press date: 5 November 2023
Keywords: CuCr alloy, high-pressure torsion, annealing, microstructure, texture, thermal stability

Identifiers

Local EPrints ID: 483784
URI: http://eprints.soton.ac.uk/id/eprint/483784
ISSN: 0141-8610
PURE UUID: 187009b0-4c3b-4e11-ba00-396c75102947
ORCID for Y. Huang: ORCID iD orcid.org/0000-0001-9259-8123
ORCID for T.G. Langdon: ORCID iD orcid.org/0000-0003-3541-9250

Catalogue record

Date deposited: 06 Nov 2023 17:37
Last modified: 05 Nov 2024 05:01

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Contributors

Author: I. Bibimounea
Author: K. Abib
Author: T. Baudin
Author: F. Brisset
Author: Y. Huang ORCID iD
Author: D. Bradai
Author: T.G. Langdon ORCID iD

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