Hybrid integration methodology for quantum cascade lasers with germanium waveguides in mid-IR
Hybrid integration methodology for quantum cascade lasers with germanium waveguides in mid-IR
Mid-infrared quantum cascade lasers (QCLs) operating around 5.7 μm have been integrated with germanium waveguides on silicon substrates. QCL bars have been designed and fabricated at the University of Sheffield for the purpose of integration. This hybrid approach uses flip-chip technology that has been successfully transferred from a silicon-on-oxide (SOI) platform working at communication wavelengths, demonstrating the flexibility of this approach. Integration challenges are introduced, and solutions discussed, leading to the next iteration of design presented here.
Integration, QCL, Lasers, Silicon Photonics, germanium, Mid-IR
Mitchell, Colin J.
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Osman, Ahmed
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Li, Ke
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Penadés, Jordi S.
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Nedeljković, Miloš
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Zhou, Longqi
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Groom, Kristian M.
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Heffernan, Jon
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Mashanovich, Goran
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Mitchell, Colin J.
0e48c936-a405-434d-818a-d83e382aa826
Osman, Ahmed
eb387b50-c718-47df-ac90-97b2efd3e335
Li, Ke
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Penadés, Jordi S.
f18f3619-0d71-4547-95fd-dd38c37b7adb
Nedeljković, Miloš
b64e21c2-1b95-479d-a35c-3456dff8c796
Zhou, Longqi
f296d143-603b-45de-bca5-cfd08aaf80cf
Groom, Kristian M.
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Heffernan, Jon
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Mashanovich, Goran
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Mitchell, Colin J., Osman, Ahmed, Li, Ke, Penadés, Jordi S., Nedeljković, Miloš, Zhou, Longqi, Groom, Kristian M., Heffernan, Jon and Mashanovich, Goran
(2022)
Hybrid integration methodology for quantum cascade lasers with germanium waveguides in mid-IR.
Costa, M.F., Flores-Arias, M., Pauliat, G. and Segonds, P.
(eds.)
In EPJ Web of Conferences: EOS Annual Meeting (EOSAM 2022).
vol. 266,
EDP Sciences.
2 pp
.
(doi:10.1051/epjconf/202226601008).
Record type:
Conference or Workshop Item
(Paper)
Abstract
Mid-infrared quantum cascade lasers (QCLs) operating around 5.7 μm have been integrated with germanium waveguides on silicon substrates. QCL bars have been designed and fabricated at the University of Sheffield for the purpose of integration. This hybrid approach uses flip-chip technology that has been successfully transferred from a silicon-on-oxide (SOI) platform working at communication wavelengths, demonstrating the flexibility of this approach. Integration challenges are introduced, and solutions discussed, leading to the next iteration of design presented here.
Text
Mitchell CJ - EOSAM 2022_submitted final
- Accepted Manuscript
Text
epjconf_eosam2022_01008
- Version of Record
More information
e-pub ahead of print date: 13 October 2022
Venue - Dates:
EOS Annual Meeting 2022, FEUP, Porto, Portugal, 2022-09-05 - 2022-09-16
Keywords:
Integration, QCL, Lasers, Silicon Photonics, germanium, Mid-IR
Identifiers
Local EPrints ID: 484534
URI: http://eprints.soton.ac.uk/id/eprint/484534
PURE UUID: 0fc4bd07-63bc-4973-8280-42bbf5fcac05
Catalogue record
Date deposited: 16 Nov 2023 14:46
Last modified: 29 Oct 2024 02:45
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Contributors
Author:
Colin J. Mitchell
Author:
Ahmed Osman
Author:
Ke Li
Author:
Jordi S. Penadés
Author:
Miloš Nedeljković
Author:
Longqi Zhou
Author:
Kristian M. Groom
Author:
Jon Heffernan
Author:
Goran Mashanovich
Editor:
M.F. Costa
Editor:
M. Flores-Arias
Editor:
G. Pauliat
Editor:
P. Segonds
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