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High-temperature energy storage performances of ‘‘isomer-like’’ polyimide and its thermoplastic polyurethane blending system

High-temperature energy storage performances of ‘‘isomer-like’’ polyimide and its thermoplastic polyurethane blending system
High-temperature energy storage performances of ‘‘isomer-like’’ polyimide and its thermoplastic polyurethane blending system

With the rapid development of high-temperature energy storage devices, polyimide films with excellent thermal stability have become candidates for capacitor materials. However, the energy density (U e) and efficiency (η) of the most commonly used polyimide (common PI) decrease exponentially at high temperatures. In this work, the “isomer-like” of common PI (i-PI) is prepared by optimizing the structure of the repeating unit of common PI. Compared with the common PI film (U e of 0.59 J cm −3 and η of 24% at 150 °C), the i-PI film obtains a high U e of 3.48 J cm −3 with an η of 54% at 150 °C. The adjustment of the position of the ether bond reduces the interchain space of the polymer, which decreases the free volume for electron acceleration resulting in a better insulation performance. Then, flexible thermoplastic polyurethane (TPU) with high dielectric permittivity is introduced into i-PI, which further reduces the interchain space. The obtained TPU/i-PI film achieves a synergistic improvement in dielectric permittivity and breakdown strength. At 150 °C, the high U e of 4.23 J cm −3 with η of 73% is achieved. Compared with those of common PI, U e and η of TPU/i-PI film are improved by 617% and 204%, respectively. Therefore, reducing the interchain space by optimizing the polymer chains is a feasible method to enhance the high-temperature capacitive performance.

2050-7526
17326-17335
Liu, Xue-Jie
dab46418-6036-4746-8b3f-812891abf070
Zheng, Ming-Sheng
91943525-d64e-47a0-9f44-c4ed1c4f2583
Chi, Qingguo
da7c0371-aa02-40d3-ae93-0a886348bb62
Zhang, Yiyi
349e4c00-5c01-4152-a8e5-ca4cb18a8152
Dang, Zhi-Min
98968104-f99c-4ee9-9281-18d9087b8840
Chen, George
3de45a9c-6c9a-4bcb-90c3-d7e26be21819
Zha, Jun-Wei
745ebec4-d0b5-4331-908b-6b36bde76e5c
Liu, Xue-Jie
dab46418-6036-4746-8b3f-812891abf070
Zheng, Ming-Sheng
91943525-d64e-47a0-9f44-c4ed1c4f2583
Chi, Qingguo
da7c0371-aa02-40d3-ae93-0a886348bb62
Zhang, Yiyi
349e4c00-5c01-4152-a8e5-ca4cb18a8152
Dang, Zhi-Min
98968104-f99c-4ee9-9281-18d9087b8840
Chen, George
3de45a9c-6c9a-4bcb-90c3-d7e26be21819
Zha, Jun-Wei
745ebec4-d0b5-4331-908b-6b36bde76e5c

Liu, Xue-Jie, Zheng, Ming-Sheng, Chi, Qingguo, Zhang, Yiyi, Dang, Zhi-Min, Chen, George and Zha, Jun-Wei (2022) High-temperature energy storage performances of ‘‘isomer-like’’ polyimide and its thermoplastic polyurethane blending system. Journal of Materials Chemistry C, 10 (45), 17326-17335. (doi:10.1039/D2TC03043H).

Record type: Article

Abstract

With the rapid development of high-temperature energy storage devices, polyimide films with excellent thermal stability have become candidates for capacitor materials. However, the energy density (U e) and efficiency (η) of the most commonly used polyimide (common PI) decrease exponentially at high temperatures. In this work, the “isomer-like” of common PI (i-PI) is prepared by optimizing the structure of the repeating unit of common PI. Compared with the common PI film (U e of 0.59 J cm −3 and η of 24% at 150 °C), the i-PI film obtains a high U e of 3.48 J cm −3 with an η of 54% at 150 °C. The adjustment of the position of the ether bond reduces the interchain space of the polymer, which decreases the free volume for electron acceleration resulting in a better insulation performance. Then, flexible thermoplastic polyurethane (TPU) with high dielectric permittivity is introduced into i-PI, which further reduces the interchain space. The obtained TPU/i-PI film achieves a synergistic improvement in dielectric permittivity and breakdown strength. At 150 °C, the high U e of 4.23 J cm −3 with η of 73% is achieved. Compared with those of common PI, U e and η of TPU/i-PI film are improved by 617% and 204%, respectively. Therefore, reducing the interchain space by optimizing the polymer chains is a feasible method to enhance the high-temperature capacitive performance.

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More information

Accepted/In Press date: 28 October 2022
Published date: 31 October 2022
Additional Information: Funding Information: This work was financially supported by the National Natural Science Foundation of China (No. 51977114 & 52277022), the Fundamental Research Funds for the Central Universities (No. FRF-TP-20-02B2), the State Key Laboratory of Power System and Generation Equipment (SKLD21KM08), the Scientific and Technological Innovation Foundation of Foshan (BK21BE006 & BK22BE009), and the Key Laboratory of Engineering Dielectrics and Its Application (Harbin University of Science and Technology), Ministry of Education (KFM202101). We are grateful to Mr Gang Wang from Guangxi University for the simulation.

Identifiers

Local EPrints ID: 485180
URI: http://eprints.soton.ac.uk/id/eprint/485180
ISSN: 2050-7526
PURE UUID: 35bcacc1-ad6c-4e49-bf09-c67c500bd698

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Date deposited: 30 Nov 2023 17:57
Last modified: 05 Jun 2024 19:42

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Contributors

Author: Xue-Jie Liu
Author: Ming-Sheng Zheng
Author: Qingguo Chi
Author: Yiyi Zhang
Author: Zhi-Min Dang
Author: George Chen
Author: Jun-Wei Zha

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