Low temperature dislocation mechanisms in ordered and disordered Cu3Au

Langdon, Terence G and Dorn, John E. (1967) Low temperature dislocation mechanisms in ordered and disordered Cu₃Au. Philosophical Magazine, 17 (149). (doi:10.1080/14786436808223179). (In Press)

Record type: Article

Abstract

The temperature and strain rate dependence of the flow stress of ordered and disordered polycrystalline Cu₃Au was investigated in the range 20°–420°K. A thermally activated deformation mechanism was observed at temperatures less than ∼100°K and ∼340°K for the ordered and disordered material respectively. For ordered Cu₃Au, the experimental data were shown to correlate well with the requirements of the Peierls mechanism over the entire thermally activated region; for the disordered material, good agreement was only obtained at temperatures less than ∼120°K, and it appeared that deformation was by the intersection mechanism in the temperature range ∼220°–340°K.

It is suggested that a pseudo-Peierls mechanism occurs in ordered Cu₃Au at temperatures less than ∼100°K, and in disordered Cu₃Au at temperatures less than ∼120°K, due to splitting of the cores of screw dislocations on several planes.

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