Room temperature compressed air-stable conductive copper films for flexible electronics
Room temperature compressed air-stable conductive copper films for flexible electronics
The state-of-art technology of fabricating printed copper electronics is focussed largely on thermal sintering restricting transition towards heat sensitive flexible substrates. Herein we report a pioneering technology which eliminates the need for conventional sintering. Biopolymer stabilised copper particles are prepared such that they can be compressed at room temperature to generate air-stable films with very low resistivities (2.05 – 2.33 × 10-8 Ω m at 20 °C). A linear positive correlation of resistivity with temperature verifies excellent metallic character and electron microscopy confirms the formation of films with low porosity (< 4.6 %). An aqueous ink formulation is used to fabricate conductive patterns on filter paper, first using a fountain/dip pen and then printing to deposit more defined patterns (R < 2 Ω). The remarkable conductivity and stability of the films, coupled with the sustainability of the approach could precipitate a paradigm-shift in the use of copper inks for printable electronics.
Pereira, H. Jessica
99b16ebd-fa9f-41f0-a4fe-f0c0e22f6697
Makarovsky, Oleg
0f7312e8-33f3-4c2d-8e87-c528bad8393b
Amabilino, David. B
329476f8-899a-4c42-b4fe-732b30ca72dd
Newton, Graham. N
37e53be8-80fc-4459-9475-f67eeb8a2030
Pereira, H. Jessica
99b16ebd-fa9f-41f0-a4fe-f0c0e22f6697
Makarovsky, Oleg
0f7312e8-33f3-4c2d-8e87-c528bad8393b
Amabilino, David. B
329476f8-899a-4c42-b4fe-732b30ca72dd
Newton, Graham. N
37e53be8-80fc-4459-9475-f67eeb8a2030
Pereira, H. Jessica, Makarovsky, Oleg, Amabilino, David. B and Newton, Graham. N
(2024)
Room temperature compressed air-stable conductive copper films for flexible electronics.
npj Flexible Electronics, 8 (1), [44].
(doi:10.1038/s41528-024-00331-1).
Abstract
The state-of-art technology of fabricating printed copper electronics is focussed largely on thermal sintering restricting transition towards heat sensitive flexible substrates. Herein we report a pioneering technology which eliminates the need for conventional sintering. Biopolymer stabilised copper particles are prepared such that they can be compressed at room temperature to generate air-stable films with very low resistivities (2.05 – 2.33 × 10-8 Ω m at 20 °C). A linear positive correlation of resistivity with temperature verifies excellent metallic character and electron microscopy confirms the formation of films with low porosity (< 4.6 %). An aqueous ink formulation is used to fabricate conductive patterns on filter paper, first using a fountain/dip pen and then printing to deposit more defined patterns (R < 2 Ω). The remarkable conductivity and stability of the films, coupled with the sustainability of the approach could precipitate a paradigm-shift in the use of copper inks for printable electronics.
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Accepted/In Press date: 19 July 2024
e-pub ahead of print date: 27 July 2024
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Local EPrints ID: 492677
URI: http://eprints.soton.ac.uk/id/eprint/492677
PURE UUID: e18820eb-f3b1-49bd-a224-50d2f6a0600a
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Date deposited: 12 Aug 2024 16:32
Last modified: 15 Aug 2024 02:22
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Author:
H. Jessica Pereira
Author:
Oleg Makarovsky
Author:
David. B Amabilino
Author:
Graham. N Newton
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