Thermal resistance of heated superhydrophobic channels with thermocapillary stress
Thermal resistance of heated superhydrophobic channels with thermocapillary stress
A pressure-driven channel flow between a longitudinally ridged superhydrophobic surface (SHS) and solid wall is studied, where a constant heat flux enters the channel from either the SHS or solid wall. First, a model is developed which neglects thermocapillary stresses (TCS) in the transverse direction. The caloric, convective, and total thermal resistance are evaluated, and their dependence on the shape of the liquid–gas interface (meniscus), gas ridge width, texture period, channel height, streamwise TCS, Péclet number, and channel length is established. The caloric resistance is minimized with menisci that protrude into the gas cavity, large slip fractions, small channel heights, and small streamwise TCSs. When heating from the SHS, the convective resistance increases, and therefore, a design compromise exists between caloric and convective resistances. However, when heating from the solid wall, the convective resistance remains the same and SHSs that minimize caloric resistance are optimal. We investigate both water and Galinstan for microchannel applications and find that both configurations can have a lower total thermal resistance than a smooth-walled channel. Heating from the solid wall is shown to always have the lowest total thermal resistance. Numerical simulations are used to analyze the effect of transverse TCSs. Our model captures much of the physics in heated superhydrophobic channels but is computationally inexpensive when compared to the numerical simulations.
Tomlinson, Samuel D.
a141bbb2-fa5e-4b6d-9b54-c155743b25e6
Mayer, Michael D.
b0da1ba6-7931-492e-8127-9eb0ef40f035
Kirk, Toby L.
7bad334e-c216-4f4a-b6b3-cca90324b37c
Hodes, Marc
31732b12-8b18-4b0e-9bc8-6dc690229ae9
Papageorgiou, Demetrios T.
deb25b82-b6bf-4f0d-afd0-3dfba527b23a
1 February 2024
Tomlinson, Samuel D.
a141bbb2-fa5e-4b6d-9b54-c155743b25e6
Mayer, Michael D.
b0da1ba6-7931-492e-8127-9eb0ef40f035
Kirk, Toby L.
7bad334e-c216-4f4a-b6b3-cca90324b37c
Hodes, Marc
31732b12-8b18-4b0e-9bc8-6dc690229ae9
Papageorgiou, Demetrios T.
deb25b82-b6bf-4f0d-afd0-3dfba527b23a
Tomlinson, Samuel D., Mayer, Michael D., Kirk, Toby L., Hodes, Marc and Papageorgiou, Demetrios T.
(2024)
Thermal resistance of heated superhydrophobic channels with thermocapillary stress.
ASME Journal of Heat and Mass Transfer, 146 (2), [021601].
(doi:10.1115/1.4063880).
Abstract
A pressure-driven channel flow between a longitudinally ridged superhydrophobic surface (SHS) and solid wall is studied, where a constant heat flux enters the channel from either the SHS or solid wall. First, a model is developed which neglects thermocapillary stresses (TCS) in the transverse direction. The caloric, convective, and total thermal resistance are evaluated, and their dependence on the shape of the liquid–gas interface (meniscus), gas ridge width, texture period, channel height, streamwise TCS, Péclet number, and channel length is established. The caloric resistance is minimized with menisci that protrude into the gas cavity, large slip fractions, small channel heights, and small streamwise TCSs. When heating from the SHS, the convective resistance increases, and therefore, a design compromise exists between caloric and convective resistances. However, when heating from the solid wall, the convective resistance remains the same and SHSs that minimize caloric resistance are optimal. We investigate both water and Galinstan for microchannel applications and find that both configurations can have a lower total thermal resistance than a smooth-walled channel. Heating from the solid wall is shown to always have the lowest total thermal resistance. Numerical simulations are used to analyze the effect of transverse TCSs. Our model captures much of the physics in heated superhydrophobic channels but is computationally inexpensive when compared to the numerical simulations.
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Accepted/In Press date: 27 September 2023
e-pub ahead of print date: 9 November 2023
Published date: 1 February 2024
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Copyright © 2024 by ASME.
Identifiers
Local EPrints ID: 495666
URI: http://eprints.soton.ac.uk/id/eprint/495666
ISSN: 2832-8450
PURE UUID: cb6726ce-d963-470a-936e-dc84d49e101f
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Date deposited: 20 Nov 2024 17:42
Last modified: 21 Nov 2024 03:11
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Contributors
Author:
Samuel D. Tomlinson
Author:
Michael D. Mayer
Author:
Toby L. Kirk
Author:
Marc Hodes
Author:
Demetrios T. Papageorgiou
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