Effect of oxide scale on temperature-dependent interfacial heat transfer in hot stamping process
Effect of oxide scale on temperature-dependent interfacial heat transfer in hot stamping process
An optimization-based numerical procedure was developed to determine the temperature-dependent interfacial heat transfer coefficient (IHTC). The effects of temperature, pressure and oxide scale thickness were analyzed, for oxide thickness between 9 μm and 156 μm and pressure from 8 MPa to 42 MPa. Oxide scales and contact pressure both show distinctive effects on IHTC in the cooling process. The average IHTC decreases about 2461 W/(m2 °C) with the increase of oxide scale thickness and increases 2620 W/(m2 °C) with the increase of pressure. Based on the two-way ANOVA, the effect of contact pressure influences the IHTC most. Their mutual interaction is negligible. The IHTC decreases when the average temperature between the blank and die surface is above 250 °C and increases when the latent heat release.
1475-1483
Hu, Ping
ee027350-5623-47d2-935e-4a7656f3ed0d
Ying, Liang
d56dfe6b-4cdc-4d02-83e6-b24765b871f9
Li, Ye
86d13351-982d-46c3-9347-22794f647f86
Liao, Zhengwei
76b4f16d-ccad-40af-91c0-9ad4b30ef89f
September 2013
Hu, Ping
ee027350-5623-47d2-935e-4a7656f3ed0d
Ying, Liang
d56dfe6b-4cdc-4d02-83e6-b24765b871f9
Li, Ye
86d13351-982d-46c3-9347-22794f647f86
Liao, Zhengwei
76b4f16d-ccad-40af-91c0-9ad4b30ef89f
Hu, Ping, Ying, Liang, Li, Ye and Liao, Zhengwei
(2013)
Effect of oxide scale on temperature-dependent interfacial heat transfer in hot stamping process.
Journal of Materials Processing Technology, 213 (9), .
(doi:10.1016/J.JMATPROTEC.2013.03.010).
Abstract
An optimization-based numerical procedure was developed to determine the temperature-dependent interfacial heat transfer coefficient (IHTC). The effects of temperature, pressure and oxide scale thickness were analyzed, for oxide thickness between 9 μm and 156 μm and pressure from 8 MPa to 42 MPa. Oxide scales and contact pressure both show distinctive effects on IHTC in the cooling process. The average IHTC decreases about 2461 W/(m2 °C) with the increase of oxide scale thickness and increases 2620 W/(m2 °C) with the increase of pressure. Based on the two-way ANOVA, the effect of contact pressure influences the IHTC most. Their mutual interaction is negligible. The IHTC decreases when the average temperature between the blank and die surface is above 250 °C and increases when the latent heat release.
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Accepted/In Press date: 10 March 2013
e-pub ahead of print date: 18 March 2013
Published date: September 2013
Identifiers
Local EPrints ID: 497309
URI: http://eprints.soton.ac.uk/id/eprint/497309
ISSN: 0924-0136
PURE UUID: be48c2bf-d679-4711-8032-d2fdbdcdb473
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Date deposited: 17 Jan 2025 18:04
Last modified: 18 Jan 2025 03:23
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Author:
Ping Hu
Author:
Liang Ying
Author:
Ye Li
Author:
Zhengwei Liao
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