Yi, H., Hancock, I., Chen, D. and Zhou, C. (2021) An improved Weibull model with consideration of thermal stress for analysis of cable joint failures. In Proceedings of the 2020 IEEE 3rd International Conference on Dielectrics, ICD 2020. (doi:10.1109/ICD46958.2020.9341878).
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Published date: 4 February 2021
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Local EPrints ID: 498963
URI: http://eprints.soton.ac.uk/id/eprint/498963
PURE UUID: 769d116d-60a6-42fd-8929-e6d9e6e75dc8
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Date deposited: 05 Mar 2025 17:57
Last modified: 06 Mar 2025 03:08
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Author:
H. Yi
Author:
I. Hancock
Author:
D. Chen
Author:
C. Zhou
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