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3D imaging of electrical-thermal-mechanical deformation on bonding wire loops using phase-sensitive line-field optical coherence tomography

3D imaging of electrical-thermal-mechanical deformation on bonding wire loops using phase-sensitive line-field optical coherence tomography
3D imaging of electrical-thermal-mechanical deformation on bonding wire loops using phase-sensitive line-field optical coherence tomography
The repetitive electrical-thermal-mechanical deformation causes bonding wires failures that can damage whole power electronic modules. The LF-OCT can measure electrical-thermal-mechanical deformation on a bonding wire's loop, which can help the reliability analysis of bonding wires.
Optica Publishing Group
Zhao, Zhiyi
a39dcbaa-eea0-485f-8451-72e25daf2c34
Zhang, Zijian
9c8aa2d5-7a7e-4ac1-ba79-b3de71db2e4a
Yang, Xingyu
8a9e405f-212a-42c8-888f-fd6c609774f6
Hu, Yihua
3d627ffe-d96b-4498-a4e2-13bc821e4d88
Xu, Ju
01a01bbe-ba4e-43f8-a421-9d5ef5b25f9a
Shen, Yaochun
0dd7fc84-23be-4931-b718-057db1286a39
Chu, D.
Park, J.
Cheng, C.
Ferraro, P.
Zhao, Zhiyi
a39dcbaa-eea0-485f-8451-72e25daf2c34
Zhang, Zijian
9c8aa2d5-7a7e-4ac1-ba79-b3de71db2e4a
Yang, Xingyu
8a9e405f-212a-42c8-888f-fd6c609774f6
Hu, Yihua
3d627ffe-d96b-4498-a4e2-13bc821e4d88
Xu, Ju
01a01bbe-ba4e-43f8-a421-9d5ef5b25f9a
Shen, Yaochun
0dd7fc84-23be-4931-b718-057db1286a39
Chu, D.
Park, J.
Cheng, C.
Ferraro, P.

Zhao, Zhiyi, Zhang, Zijian, Yang, Xingyu, Hu, Yihua, Xu, Ju and Shen, Yaochun (2022) 3D imaging of electrical-thermal-mechanical deformation on bonding wire loops using phase-sensitive line-field optical coherence tomography. Chu, D., Park, J., Cheng, C. and Ferraro, P. (eds.) In Digital Holography and 3-D Imaging 2022. Optica Publishing Group.. (doi:10.1364/dh.2022.tu4a.2).

Record type: Conference or Workshop Item (Paper)

Abstract

The repetitive electrical-thermal-mechanical deformation causes bonding wires failures that can damage whole power electronic modules. The LF-OCT can measure electrical-thermal-mechanical deformation on a bonding wire's loop, which can help the reliability analysis of bonding wires.

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Published date: 2022

Identifiers

Local EPrints ID: 499155
URI: http://eprints.soton.ac.uk/id/eprint/499155
PURE UUID: 71a450ab-11b8-401a-a0f5-f05a2e4ee74d
ORCID for Xingyu Yang: ORCID iD orcid.org/0000-0003-2871-8025

Catalogue record

Date deposited: 11 Mar 2025 17:32
Last modified: 12 Mar 2025 03:15

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Contributors

Author: Zhiyi Zhao
Author: Zijian Zhang
Author: Xingyu Yang ORCID iD
Author: Yihua Hu
Author: Ju Xu
Author: Yaochun Shen
Editor: D. Chu
Editor: J. Park
Editor: C. Cheng
Editor: P. Ferraro

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