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Physics-informed machine learning for predicting fatigue damage of wire bonds in power electronic modules

Physics-informed machine learning for predicting fatigue damage of wire bonds in power electronic modules
Physics-informed machine learning for predicting fatigue damage of wire bonds in power electronic modules
This paper details a novel physics-informed data-driven approach for developing computationally fast metamodels for predicting fatigue damage and its spatial distribution at common failure sites of power electronic components. The proposed metamodels aim to serve the end-users of these power components by allowing an informative model-based assessment of the thermal fatigue damage in the assembly materials due to different application-specific, qualification and user-defined load conditions, removing current requirements for comprehensive device characterisations and deploying complex finite element (FE) models. The proposed methodology is demonstrated with two different metamodel structures, a multi-quadratic function, and a neural network, for the problem of predicting the thermal fatigue damage due to temperature cycling loads in the wire bonds of an IGBT power electronic module (PEM). The results confirmed that the proposed approach and the modelling technology can offer FE-matching accuracy and capability to map highly nonlinear spatial distributions of the damage parameter over local sub-domains associated with material fatigue degradation and failure due to material/interfacial cracking.
IEEE
Stoyanov, Stoyan
ad91d3cb-a0be-49af-9047-93aafcae78c4
Tilford, Tim
35bd0c6c-d677-40c9-9223-898d7b6f0fc7
Zhang, Xiaotian
b1c00fe2-efd6-460c-a2ab-a1725539cbf8
Hu, Yihua
3d627ffe-d96b-4498-a4e2-13bc821e4d88
Yang, Xingyu
8a9e405f-212a-42c8-888f-fd6c609774f6
Shen, Yaochun
0dd7fc84-23be-4931-b718-057db1286a39
Stoyanov, Stoyan
ad91d3cb-a0be-49af-9047-93aafcae78c4
Tilford, Tim
35bd0c6c-d677-40c9-9223-898d7b6f0fc7
Zhang, Xiaotian
b1c00fe2-efd6-460c-a2ab-a1725539cbf8
Hu, Yihua
3d627ffe-d96b-4498-a4e2-13bc821e4d88
Yang, Xingyu
8a9e405f-212a-42c8-888f-fd6c609774f6
Shen, Yaochun
0dd7fc84-23be-4931-b718-057db1286a39

Stoyanov, Stoyan, Tilford, Tim, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed machine learning for predicting fatigue damage of wire bonds in power electronic modules. In 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE. 8 pp . (doi:10.1109/eurosime60745.2024.10491522).

Record type: Conference or Workshop Item (Paper)

Abstract

This paper details a novel physics-informed data-driven approach for developing computationally fast metamodels for predicting fatigue damage and its spatial distribution at common failure sites of power electronic components. The proposed metamodels aim to serve the end-users of these power components by allowing an informative model-based assessment of the thermal fatigue damage in the assembly materials due to different application-specific, qualification and user-defined load conditions, removing current requirements for comprehensive device characterisations and deploying complex finite element (FE) models. The proposed methodology is demonstrated with two different metamodel structures, a multi-quadratic function, and a neural network, for the problem of predicting the thermal fatigue damage due to temperature cycling loads in the wire bonds of an IGBT power electronic module (PEM). The results confirmed that the proposed approach and the modelling technology can offer FE-matching accuracy and capability to map highly nonlinear spatial distributions of the damage parameter over local sub-domains associated with material fatigue degradation and failure due to material/interfacial cracking.

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Published date: 9 April 2024

Identifiers

Local EPrints ID: 499452
URI: http://eprints.soton.ac.uk/id/eprint/499452
PURE UUID: 3ed321bd-7c89-4267-806e-1935b22d088b
ORCID for Xingyu Yang: ORCID iD orcid.org/0000-0003-2871-8025

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Date deposited: 20 Mar 2025 17:49
Last modified: 22 Mar 2025 03:19

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Contributors

Author: Stoyan Stoyanov
Author: Tim Tilford
Author: Xiaotian Zhang
Author: Yihua Hu
Author: Xingyu Yang ORCID iD
Author: Yaochun Shen

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