Physical machining of chambers, vias, and monolithic mirrors in silicon for quantum technologies
Physical machining of chambers, vias, and monolithic mirrors in silicon for quantum technologies
We present a scalable ultra-precision micro-machining approach to 2.5D fabrication of quantum components. Apertures, wells, and vias were achieved in up to 6mm thick silicon, as well as internal, optical-grade mirrors for light coupling.
Gow, Paul C.
193394b1-fe2d-41de-a9aa-6de7e5925b18
Churchill, Glenn
5933a331-fba3-444b-8352-273112c3d6a6
Keen, Joel Mark Nelson
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Gawith, Corin
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Gates, James
b71e31a1-8caa-477e-8556-b64f6cae0dc2
June 2025
Gow, Paul C.
193394b1-fe2d-41de-a9aa-6de7e5925b18
Churchill, Glenn
5933a331-fba3-444b-8352-273112c3d6a6
Keen, Joel Mark Nelson
8303157c-da0d-451d-8d97-a93b483d0283
Gawith, Corin
926665c0-84c7-4a1d-ae19-ee6d7d14c43e
Gates, James
b71e31a1-8caa-477e-8556-b64f6cae0dc2
Gow, Paul C., Churchill, Glenn, Keen, Joel Mark Nelson, Gawith, Corin and Gates, James
(2025)
Physical machining of chambers, vias, and monolithic mirrors in silicon for quantum technologies.
CLEO/Europe-EQEC 2025, , Munich, Germany.
23 - 27 Jun 2025.
Record type:
Conference or Workshop Item
(Poster)
Abstract
We present a scalable ultra-precision micro-machining approach to 2.5D fabrication of quantum components. Apertures, wells, and vias were achieved in up to 6mm thick silicon, as well as internal, optical-grade mirrors for light coupling.
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More information
Published date: June 2025
Venue - Dates:
CLEO/Europe-EQEC 2025, , Munich, Germany, 2025-06-23 - 2025-06-27
Identifiers
Local EPrints ID: 501961
URI: http://eprints.soton.ac.uk/id/eprint/501961
PURE UUID: 4ecfd93d-4783-4717-a795-334e9dbf32c3
Catalogue record
Date deposited: 12 Jun 2025 17:04
Last modified: 13 Jun 2025 02:14
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Contributors
Author:
Paul C. Gow
Author:
Glenn Churchill
Author:
Joel Mark Nelson Keen
Author:
Corin Gawith
Author:
James Gates
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