Investigation of SiO2 cladding application on Ta2O5 films for reduction of delamination during dicing
Investigation of SiO2 cladding application on Ta2O5 films for reduction of delamination during dicing
Gow, Paul C.
193394b1-fe2d-41de-a9aa-6de7e5925b18
Wang, Wenjie
f06ced2c-bc2f-4816-92cf-f0ad49f63565
Churchill, Glenn
5933a331-fba3-444b-8352-273112c3d6a6
Charlton, M.D.B
388d72a8-13be-4bf7-8291-52d7a51d3c3d
Gawith, Corin
926665c0-84c7-4a1d-ae19-ee6d7d14c43e
Gates, James
b71e31a1-8caa-477e-8556-b64f6cae0dc2
Gow, Paul C.
193394b1-fe2d-41de-a9aa-6de7e5925b18
Wang, Wenjie
f06ced2c-bc2f-4816-92cf-f0ad49f63565
Churchill, Glenn
5933a331-fba3-444b-8352-273112c3d6a6
Charlton, M.D.B
388d72a8-13be-4bf7-8291-52d7a51d3c3d
Gawith, Corin
926665c0-84c7-4a1d-ae19-ee6d7d14c43e
Gates, James
b71e31a1-8caa-477e-8556-b64f6cae0dc2
Gow, Paul C., Wang, Wenjie, Churchill, Glenn, Charlton, M.D.B, Gawith, Corin and Gates, James
(2025)
Investigation of SiO2 cladding application on Ta2O5 films for reduction of delamination during dicing.
Electronics Letters, 61 (1).
(doi:10.1049/ell2.70442).
(In Press)
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Submitted date: 2025
Accepted/In Press date: 8 October 2025
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Local EPrints ID: 502594
URI: http://eprints.soton.ac.uk/id/eprint/502594
ISSN: 0013-5194
PURE UUID: 11a4759f-49bd-4853-bd6b-a70c41e14e8b
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Date deposited: 01 Jul 2025 16:53
Last modified: 09 Oct 2025 02:09
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