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Investigation of SiO2 cladding application on Ta2O5 films for reduction of delamination during dicing

Investigation of SiO2 cladding application on Ta2O5 films for reduction of delamination during dicing
Investigation of SiO2 cladding application on Ta2O5 films for reduction of delamination during dicing
0013-5194
Gow, Paul C.
193394b1-fe2d-41de-a9aa-6de7e5925b18
Wang, Wenjie
f06ced2c-bc2f-4816-92cf-f0ad49f63565
Churchill, Glenn
5933a331-fba3-444b-8352-273112c3d6a6
Charlton, M.D.B
388d72a8-13be-4bf7-8291-52d7a51d3c3d
Gawith, Corin
926665c0-84c7-4a1d-ae19-ee6d7d14c43e
Gates, James
b71e31a1-8caa-477e-8556-b64f6cae0dc2
Gow, Paul C.
193394b1-fe2d-41de-a9aa-6de7e5925b18
Wang, Wenjie
f06ced2c-bc2f-4816-92cf-f0ad49f63565
Churchill, Glenn
5933a331-fba3-444b-8352-273112c3d6a6
Charlton, M.D.B
388d72a8-13be-4bf7-8291-52d7a51d3c3d
Gawith, Corin
926665c0-84c7-4a1d-ae19-ee6d7d14c43e
Gates, James
b71e31a1-8caa-477e-8556-b64f6cae0dc2

Gow, Paul C., Wang, Wenjie, Churchill, Glenn, Charlton, M.D.B, Gawith, Corin and Gates, James (2025) Investigation of SiO2 cladding application on Ta2O5 films for reduction of delamination during dicing. Electronics Letters, 61 (1). (doi:10.1049/ell2.70442). (In Press)

Record type: Letter

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More information

Submitted date: 2025
Accepted/In Press date: 8 October 2025

Identifiers

Local EPrints ID: 502594
URI: http://eprints.soton.ac.uk/id/eprint/502594
ISSN: 0013-5194
PURE UUID: 11a4759f-49bd-4853-bd6b-a70c41e14e8b
ORCID for Paul C. Gow: ORCID iD orcid.org/0000-0002-3247-9082
ORCID for Wenjie Wang: ORCID iD orcid.org/0000-0001-5739-3085
ORCID for Glenn Churchill: ORCID iD orcid.org/0000-0001-7621-7618
ORCID for Corin Gawith: ORCID iD orcid.org/0000-0002-3502-3558
ORCID for James Gates: ORCID iD orcid.org/0000-0001-8671-5987

Catalogue record

Date deposited: 01 Jul 2025 16:53
Last modified: 09 Oct 2025 02:09

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Contributors

Author: Paul C. Gow ORCID iD
Author: Wenjie Wang ORCID iD
Author: Glenn Churchill ORCID iD
Author: M.D.B Charlton
Author: Corin Gawith ORCID iD
Author: James Gates ORCID iD

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