Microstructure and strength modelling of Al-Cu-Mg alloys during non-isothermal treatments: part 2 - Welds


Khan, I.N., Starink, M.J., Sinclair, I. and Wang, S.C. (2008) Microstructure and strength modelling of Al-Cu-Mg alloys during non-isothermal treatments: part 2 - Welds Materials Science and Technology, 24, pp. 1411-1418.

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Description/Abstract

The present work applies a model for microstructural evolution in the solid state and Al-Cu-Mg alloys and expands it in a computationally efficient way to include solid-liquid reactions in fusion welds. The model is used to predict local strength and hardness of the welds, using a formulation that incorporates hardening due to two types of precipitates i.e. Cu-Mg co-clusters and the S phase precipitates. The model predictions are compared with hardness, differential scanning calorimetry and transmission electron microscopy data for a fusion welded 2024-T351 aluminium alloy. The model predicts solid state reactions and solid-liquid reactions including co-cluster dissolution, S phase formation, growth, coarsening and dissolution, co-cluster reformation on cooling, and solute partitioning on re-solidification. The model predictions are in good agreement with the experimental results and illustrate the dominant role that (sub-) nano scale co-clusters play in strengthening of welds. The yield strength of as-welded material tested normal to the weld is mainly due to the co-clusters.

Item Type: Article
ISSNs: 0267-0836 (print)
Related URLs:
Keywords: aluminium alloys, welds, VPPA weld, fusion weld, ageing, modelling, phase transformations, co-clusters, 2024, 2x24, Al-Cu-Mg, DSC, calorimetry, TEM, nucleation, coarsening, GPB zones, guinier-preston zones, precipitation, melting, incipient melting, solidification, aerospace alloy
Subjects:

Organisations: Engineering Mats & Surface Engineerg Gp
ePrint ID: 50900
Date :
Date Event
2008Published
Date Deposited: 11 Apr 2008
Last Modified: 16 Apr 2017 18:07
Further Information:Google Scholar
URI: http://eprints.soton.ac.uk/id/eprint/50900

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