Evaluation of the influence of various nanofillers on the AC breakdown strength of epoxy-based nanocomposites
Evaluation of the influence of various nanofillers on the AC breakdown strength of epoxy-based nanocomposites
The dielectric breakdown of polymer nanocomposites is a fundamental value for the design of high voltage applications. Previous measurements on epoxy-based nanocomposites saw a drastic increase of the short-term DC breakdown voltage. In this paper, the AC breakdown voltage is determined for the same materials. Weibull analysis was utilized to calculate the size and shape parameters of the measured values. Compared to the DC breakdown values, the results here are significantly lower due to the different breakdown mechanism that occurs under AC stress.
383-386
Kochetov, R.
9132fe00-0536-4082-a4ce-54253b2e9fe0
Andritsch, T.
8681e640-e584-424e-a1f1-0d8b713de01c
Morshuis, PH.F.
52ee8690-43df-4325-b9df-3b02a8deed87
Smit, J.J.
07c57924-c2e6-48b4-958e-41047e0369b8
5 June 2014
Kochetov, R.
9132fe00-0536-4082-a4ce-54253b2e9fe0
Andritsch, T.
8681e640-e584-424e-a1f1-0d8b713de01c
Morshuis, PH.F.
52ee8690-43df-4325-b9df-3b02a8deed87
Smit, J.J.
07c57924-c2e6-48b4-958e-41047e0369b8
Kochetov, R., Andritsch, T., Morshuis, PH.F. and Smit, J.J.
(2014)
Evaluation of the influence of various nanofillers on the AC breakdown strength of epoxy-based nanocomposites.
In Proceedings of 2011 International Conference on Electrical Insulating Materials, ISEIM 2011.
IEEE.
.
(doi:10.1109/iseim.2011.6826349).
Record type:
Conference or Workshop Item
(Paper)
Abstract
The dielectric breakdown of polymer nanocomposites is a fundamental value for the design of high voltage applications. Previous measurements on epoxy-based nanocomposites saw a drastic increase of the short-term DC breakdown voltage. In this paper, the AC breakdown voltage is determined for the same materials. Weibull analysis was utilized to calculate the size and shape parameters of the measured values. Compared to the DC breakdown values, the results here are significantly lower due to the different breakdown mechanism that occurs under AC stress.
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Published date: 5 June 2014
Venue - Dates:
2011 International Conference on Electrical Insulating Materials, ISEIM 2011, , Kyoto, Japan, 2011-09-06 - 2011-09-11
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Local EPrints ID: 509947
URI: http://eprints.soton.ac.uk/id/eprint/509947
PURE UUID: 2c6f8cd7-6ffe-47f6-92a1-8d485673a2b4
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Date deposited: 11 Mar 2026 17:45
Last modified: 12 Mar 2026 02:46
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Author:
R. Kochetov
Author:
T. Andritsch
Author:
PH.F. Morshuis
Author:
J.J. Smit
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