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Thermoelastic stress analysis of holes in laminated composite materials

Record type: Conference or Workshop Item (Paper)

The design of cut outs, or holes, in laminated composite components is of great importance in aerospace, automobile and structural engineering. The presence of these holes results in stress concentration that leads to strength degradation and possible premature failure during the operational life of the component. In this work thermoelastic stress analysis (TSA) is used for the analysis of laminated composite material. A primary consideration is to determine the source of the thermoelastic response, as recent previous work has suggested that this is from the resin rich surface layer acting as a strain witness. Having identified the source of the thermoelastic response, a general strain based calibration routine is developed. The effects of mean load, loading frequency and the increase in absolute temperature of the specimen are considered. An analysis of the effect of holes in a variety of laminated components is presented to provide experimental stress concentration factors based on TSA data. The results highlight that the thermoelastic response is affected by several factors, but also demonstrates the necessity and usefulness of experimental data in the design process.

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Citation

Sambasivam, S., Quinn, S. and Dulieu-Barton, J.M. (2008) Thermoelastic stress analysis of holes in laminated composite materials At SEM XI International Congress on Experimental and Applied Mechanics. 02 - 05 Jun 2008. 10 pp.

More information

Published date: June 2008
Venue - Dates: SEM XI International Congress on Experimental and Applied Mechanics, 2008-06-02 - 2008-06-05
Organisations: Fluid Structure Interactions Group

Identifiers

Local EPrints ID: 55267
URI: http://eprints.soton.ac.uk/id/eprint/55267
PURE UUID: b24ffe84-aa60-4c61-b110-fd820ec391b6
ORCID for S. Quinn: ORCID iD orcid.org/0000-0002-9727-5080

Catalogue record

Date deposited: 04 Aug 2008
Last modified: 17 Jul 2017 14:33

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Contributors

Author: S. Sambasivam
Author: S. Quinn ORCID iD

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