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On the concept of a fully bonded coupon gauge for stress separation from thermoelastic data

Stanley, P., Dulieu-Barton, J.M. and Emery, T.R. (2008) On the concept of a fully bonded coupon gauge for stress separation from thermoelastic data The Journal of Strain Analysis for Engineering Design, 43, (6), pp. 507-517. (doi:10.1243/03093247JSA363).

Record type: Article


Several forms of gauge can be used for the determination of individual stresses from thermoelastic data alone. A particularly useful form of gauge is the ‘coupon gauge’, consisting of a thin coupon of material which is bonded to the stressed specimen (or substrate). A novel formulation of the thermoelastic response of the fully bonded thermoelastic coupon gauge is used as the basis for the appraisal of the four possible gauge–specimen material combinations. The validity of the principal assumptions underlying the performance of these gauges is demonstrated and it is shown experimentally that the behaviour of samples of the orthotropic gauge–isotropic specimen material combination conforms to theory.

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Published date: 2008
Keywords: thermoelastic stress analysis, stress separation, bonded gauge
Organisations: Fluid Structure Interactions Group


Local EPrints ID: 55656
ISSN: 0309-3247
PURE UUID: 65e4c765-c4e4-4eb1-a41f-46d4e6d3a4d1

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Date deposited: 04 Aug 2008
Last modified: 17 Jul 2017 14:32

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Author: P. Stanley
Author: T.R. Emery

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