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Wafer bonding with nanoprecision alignment for micro/nano systems

Jiang, Liudi, Pandraud, G., French, P.J., Spearing, S.M. and Kraft, M. (2007) Wafer bonding with nanoprecision alignment for micro/nano systems At Transducers & Eurosensors '07: 14th International Conference on Solid-State Sensors, Actuators and Microsystems. 10 - 14 Jun 2007. , pp. 2103-2106. (doi:10.1109/SENSOR.2007.4300580).

Record type: Conference or Workshop Item (Paper)

Abstract

Exploiting mechanical principles of kinematic and elastic averaging, a novel passive approach has been developed to achieve nanoprecision bonding alignment. Alignment features comprising cantilever supported pyramids and V-pits have been designed and fabricated at silicon chip level. The engagement between the pyramids and pits and the compliance of the cantilevers result in the passive alignment. Infrared (IR) and scanning electron microscopy (SEM) inspections repeatedly confirmed the alignment accuracy of better than 200 nm at the bonding interface with good bonding quality. The applicability of the developed alignment technique and future works towards wafer level applications for advanced micro/nano systems are discussed.

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More information

Published date: 10 June 2007
Venue - Dates: Transducers & Eurosensors '07: 14th International Conference on Solid-State Sensors, Actuators and Microsystems, 2007-06-10 - 2007-06-14
Organisations: Engineering Mats & Surface Engineerg Gp, Engineering Science Unit

Identifiers

Local EPrints ID: 63547
URI: http://eprints.soton.ac.uk/id/eprint/63547
ISBN: 1424408423
PURE UUID: 00846327-0d34-4e7d-a15d-945ef2b5c981
ORCID for Liudi Jiang: ORCID iD orcid.org/0000-0002-3400-825X

Catalogue record

Date deposited: 20 Oct 2008
Last modified: 17 Jul 2017 14:16

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Contributors

Author: Liudi Jiang ORCID iD
Author: G. Pandraud
Author: P.J. French
Author: S.M. Spearing
Author: M. Kraft

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