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Multiscale mechanics modeling of direct silicon wafer bonding

Record type: Article

The direct bonding of macroscopically patterned silicon wafers is studied with a cohesive zone model (CZM), the form and key parameters of which are obtained from molecular dynamics simulations. The CZM is implemented in a spectral scheme. For the case of ideally flat wafer surfaces investigated here, the results are consistent with previous work in which the CZM was derived from an assumption of a continuum water film. This multiscale approach has the potential to model directly the effects of surface roughness, nanotopography and small-scale patterning on the efficacy of direct wafer bonding.

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Citation

Kubair, Dhirendra, Cole, Daniel J., Ciacci, Lucio C. and Spearing, Simon Mark (2009) Multiscale mechanics modeling of direct silicon wafer bonding Scripta Materialia, 60, (12), pp. 1125-1128. (doi:10.1016/j.scriptamat.2009.02.058).

More information

Submitted date: February 2009
Published date: June 2009
Organisations: Engineering Mats & Surface Engineerg Gp

Identifiers

Local EPrints ID: 79461
URI: http://eprints.soton.ac.uk/id/eprint/79461
ISSN: 1359-6462
PURE UUID: 9fc48d2e-0add-4e58-bf88-7807ce55be74

Catalogue record

Date deposited: 16 Mar 2010
Last modified: 18 Jul 2017 23:17

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Contributors

Author: Dhirendra Kubair
Author: Daniel J. Cole
Author: Lucio C. Ciacci

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