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Multiscale mechanics modeling of direct silicon wafer bonding

Multiscale mechanics modeling of direct silicon wafer bonding
Multiscale mechanics modeling of direct silicon wafer bonding
The direct bonding of macroscopically patterned silicon wafers is studied with a cohesive zone model (CZM), the form and key parameters of which are obtained from molecular dynamics simulations. The CZM is implemented in a spectral scheme. For the case of ideally flat wafer surfaces investigated here, the results are consistent with previous work in which the CZM was derived from an assumption of a continuum water film. This multiscale approach has the potential to model directly the effects of surface roughness, nanotopography and small-scale patterning on the efficacy of direct wafer bonding.
1359-6462
1125-1128
Kubair, Dhirendra
7d4a8f36-e23f-444a-b9f0-a9d13bdc89d0
Cole, Daniel J.
cb208a53-13ef-4871-b59b-6373abaadc39
Ciacci, Lucio C.
3da50502-02f6-40ac-99bd-03cefd2a7e3d
Spearing, Simon Mark
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a
Kubair, Dhirendra
7d4a8f36-e23f-444a-b9f0-a9d13bdc89d0
Cole, Daniel J.
cb208a53-13ef-4871-b59b-6373abaadc39
Ciacci, Lucio C.
3da50502-02f6-40ac-99bd-03cefd2a7e3d
Spearing, Simon Mark
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a

Kubair, Dhirendra, Cole, Daniel J., Ciacci, Lucio C. and Spearing, Simon Mark (2009) Multiscale mechanics modeling of direct silicon wafer bonding. Scripta Materialia, 60 (12), 1125-1128. (doi:10.1016/j.scriptamat.2009.02.058).

Record type: Article

Abstract

The direct bonding of macroscopically patterned silicon wafers is studied with a cohesive zone model (CZM), the form and key parameters of which are obtained from molecular dynamics simulations. The CZM is implemented in a spectral scheme. For the case of ideally flat wafer surfaces investigated here, the results are consistent with previous work in which the CZM was derived from an assumption of a continuum water film. This multiscale approach has the potential to model directly the effects of surface roughness, nanotopography and small-scale patterning on the efficacy of direct wafer bonding.

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More information

Submitted date: February 2009
Published date: June 2009
Organisations: Engineering Mats & Surface Engineerg Gp

Identifiers

Local EPrints ID: 79461
URI: https://eprints.soton.ac.uk/id/eprint/79461
ISSN: 1359-6462
PURE UUID: 9fc48d2e-0add-4e58-bf88-7807ce55be74
ORCID for Simon Mark Spearing: ORCID iD orcid.org/0000-0002-3059-2014

Catalogue record

Date deposited: 16 Mar 2010
Last modified: 17 May 2019 00:35

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