Multiscale mechanics modeling of direct silicon wafer bonding

Kubair, Dhirendra, Cole, Daniel J., Ciacci, Lucio C. and Spearing, Simon Mark (2009) Multiscale mechanics modeling of direct silicon wafer bonding Scripta Materialia, 60, (12), pp. 1125-1128. (doi:10.1016/j.scriptamat.2009.02.058).


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The direct bonding of macroscopically patterned silicon wafers is studied with a cohesive zone model (CZM), the form and key parameters of which are obtained from molecular dynamics simulations. The CZM is implemented in a spectral scheme. For the case of ideally flat wafer surfaces investigated here, the results are consistent with previous work in which the CZM was derived from an assumption of a continuum water film. This multiscale approach has the potential to model directly the effects of surface roughness, nanotopography and small-scale patterning on the efficacy of direct wafer bonding.

Item Type: Article
Digital Object Identifier (DOI): doi:10.1016/j.scriptamat.2009.02.058
ISSNs: 1359-6462 (print)
Organisations: Engineering Mats & Surface Engineerg Gp
ePrint ID: 79461
Date :
Date Event
February 2009Submitted
June 2009Published
Date Deposited: 16 Mar 2010
Last Modified: 18 Apr 2017 20:15
Further Information:Google Scholar

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