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Multiscale mechanics modeling of direct silicon wafer bonding

Kubair, Dhirendra, Cole, Daniel J., Ciacci, Lucio C. and Spearing, Simon Mark (2009) Multiscale mechanics modeling of direct silicon wafer bonding Scripta Materialia, 60, (12), pp. 1125-1128. (doi:10.1016/j.scriptamat.2009.02.058).

Record type: Article


The direct bonding of macroscopically patterned silicon wafers is studied with a cohesive zone model (CZM), the form and key parameters of which are obtained from molecular dynamics simulations. The CZM is implemented in a spectral scheme. For the case of ideally flat wafer surfaces investigated here, the results are consistent with previous work in which the CZM was derived from an assumption of a continuum water film. This multiscale approach has the potential to model directly the effects of surface roughness, nanotopography and small-scale patterning on the efficacy of direct wafer bonding.

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Submitted date: February 2009
Published date: June 2009
Organisations: Engineering Mats & Surface Engineerg Gp


Local EPrints ID: 79461
ISSN: 1359-6462
PURE UUID: 9fc48d2e-0add-4e58-bf88-7807ce55be74

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Date deposited: 16 Mar 2010
Last modified: 18 Jul 2017 23:17

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Author: Dhirendra Kubair
Author: Daniel J. Cole
Author: Lucio C. Ciacci

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