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Effect of layer thickness on the dielectric properties of 3D printed polypropylene composite materials

Effect of layer thickness on the dielectric properties of 3D printed polypropylene composite materials
Effect of layer thickness on the dielectric properties of 3D printed polypropylene composite materials
Fused deposition modelling (FDM) is a 3D printing technique which is widely used to fabricate complex geometries, however its application to high voltage engineering remains in its infancy. One major issue is that good dielectric materials such as polypropylene (PP) are unsuitable for 3D printing without modification, furthermore both interlayer boundaries and voiding can compromise dielectric performance. Printability can be improved by blending PP with other materials and in this current investigation, a commercial PP based filament has been employed to fabricate plaques of a fixed geometry whilst varying the number of layers from 2 to 5. In addition, the same material was compression molded to provide a reference. The thermal behavior was not impacted by 3D printing, however when a larger number of thinner layers was employed there was a reduction in the permittivity, electrical conductivity and AC electrical breakdown strength relative to the compression molded parts. The changes in dielectric properties were a direct result of the increased porosity arising from a greater number of interlayer boundaries.
Hosier, Ian
6a44329e-b742-44de-afa7-073f80a78e26
Axiotis, Dimitris
00d112b1-58fd-4c8a-a9d0-ab490e6bad5e
Vryonis, Orestis
4affde05-88f2-436f-b036-dceedf31ea9c
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Hosier, Ian
6a44329e-b742-44de-afa7-073f80a78e26
Axiotis, Dimitris
00d112b1-58fd-4c8a-a9d0-ab490e6bad5e
Vryonis, Orestis
4affde05-88f2-436f-b036-dceedf31ea9c
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c

Hosier, Ian, Axiotis, Dimitris, Vryonis, Orestis and Andritsch, Thomas (2026) Effect of layer thickness on the dielectric properties of 3D printed polypropylene composite materials. In IEEE ICD 2026 International Conference on Dielectrics. (In Press)

Record type: Conference or Workshop Item (Paper)

Abstract

Fused deposition modelling (FDM) is a 3D printing technique which is widely used to fabricate complex geometries, however its application to high voltage engineering remains in its infancy. One major issue is that good dielectric materials such as polypropylene (PP) are unsuitable for 3D printing without modification, furthermore both interlayer boundaries and voiding can compromise dielectric performance. Printability can be improved by blending PP with other materials and in this current investigation, a commercial PP based filament has been employed to fabricate plaques of a fixed geometry whilst varying the number of layers from 2 to 5. In addition, the same material was compression molded to provide a reference. The thermal behavior was not impacted by 3D printing, however when a larger number of thinner layers was employed there was a reduction in the permittivity, electrical conductivity and AC electrical breakdown strength relative to the compression molded parts. The changes in dielectric properties were a direct result of the increased porosity arising from a greater number of interlayer boundaries.

Text
ICD2026-Hosier-3DPrint-v2 - Accepted Manuscript
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Accepted/In Press date: 28 June 2026
Venue - Dates: 6th IEEE International Conference on Dielectrics, , Southampton, United Kingdom, 2026-06-21 - 2026-06-25

Identifiers

Local EPrints ID: 513924
URI: https://eprints.soton.ac.uk/id/eprint/513924
PURE UUID: 44995266-a50d-4ccb-86df-74e32a0d06ab
ORCID for Ian Hosier: ORCID iD orcid.org/0000-0003-4365-9385
ORCID for Dimitris Axiotis: ORCID iD orcid.org/0009-0000-5383-375X
ORCID for Orestis Vryonis: ORCID iD orcid.org/0000-0002-2862-4494
ORCID for Thomas Andritsch: ORCID iD orcid.org/0000-0002-3462-022X

Catalogue record

Date deposited: 02 Sep 2026 16:40
Last modified: 13 Sep 2026 15:51

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Contributors

Author: Ian Hosier ORCID iD
Author: Dimitris Axiotis ORCID iD
Author: Orestis Vryonis ORCID iD
Author: Thomas Andritsch ORCID iD

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