The University of Southampton
University of Southampton Institutional Repository

Fluidic packaging of microengine and microrocket devices for high pressure and high temperature operation

Fluidic packaging of microengine and microrocket devices for high pressure and high temperature operation
Fluidic packaging of microengine and microrocket devices for high pressure and high temperature operation
The fluidic packaging of Power MEMS devices such as the MIT microengine and microrocket requires the fabrication of hermetic seals capable of withstanding temperature in the range 20-600/spl deg/C and pressures in the range 100-300 atm. We describe an approach to such packaging by attaching Kovar metal tubes to a silicon device using glass seal technology. Failure due to fracture of the seals is a significant reliability concern in the baseline process: microscopy revealed a large number of voids in the glass, pre-cracks in the glass and silicon, and poor wetting of the glass to silicon. The effects of various processing and materials parameters on these phenomena were examined. A robust procedure, based on the use of metal-coated silicon substrates, was developed to ensure good wetting. The bending strength of single-tube specimens was determined at several temperatures. The dominant failure mode changed from fracture at room temperature to yielding of the glass and Kovar at 600/spl deg/C. The strength in tension at room temperature was analyzed using Weibull statistics; these results indicate a probability of survival of 0.99 at an operational pressure of 125 atm at room temperature for single tubes and a corresponding probability of 0.9 for a packaged device with 11 joints. The residual stresses were analyzed using the method of finite elements and recommendations for the improvement of packaging reliability are suggested.
1057-7157
31-40
Peles, Y.
cc12a2e4-ff26-44a2-94f3-f9955bcc3a7e
Srikar, V.T.
168310a0-86f6-405e-8b9f-5c995cb5f238
Harrison, T.S.
809140ba-f648-44e5-b959-53c46c54f5b2
Mracek, A.
21380e9c-0854-46a4-8d3c-197a47190976
Spearing, S.M.
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a
Peles, Y.
cc12a2e4-ff26-44a2-94f3-f9955bcc3a7e
Srikar, V.T.
168310a0-86f6-405e-8b9f-5c995cb5f238
Harrison, T.S.
809140ba-f648-44e5-b959-53c46c54f5b2
Mracek, A.
21380e9c-0854-46a4-8d3c-197a47190976
Spearing, S.M.
9e56a7b3-e0e8-47b1-a6b4-db676ed3c17a

Peles, Y., Srikar, V.T., Harrison, T.S., Mracek, A. and Spearing, S.M. (2004) Fluidic packaging of microengine and microrocket devices for high pressure and high temperature operation. Journal of Microelectromechanical Systems, 13 (1), 31-40. (doi:10.1109/JMEMS.2003.823223).

Record type: Article

Abstract

The fluidic packaging of Power MEMS devices such as the MIT microengine and microrocket requires the fabrication of hermetic seals capable of withstanding temperature in the range 20-600/spl deg/C and pressures in the range 100-300 atm. We describe an approach to such packaging by attaching Kovar metal tubes to a silicon device using glass seal technology. Failure due to fracture of the seals is a significant reliability concern in the baseline process: microscopy revealed a large number of voids in the glass, pre-cracks in the glass and silicon, and poor wetting of the glass to silicon. The effects of various processing and materials parameters on these phenomena were examined. A robust procedure, based on the use of metal-coated silicon substrates, was developed to ensure good wetting. The bending strength of single-tube specimens was determined at several temperatures. The dominant failure mode changed from fracture at room temperature to yielding of the glass and Kovar at 600/spl deg/C. The strength in tension at room temperature was analyzed using Weibull statistics; these results indicate a probability of survival of 0.99 at an operational pressure of 125 atm at room temperature for single tubes and a corresponding probability of 0.9 for a packaged device with 11 joints. The residual stresses were analyzed using the method of finite elements and recommendations for the improvement of packaging reliability are suggested.

Text
22778.pdf - Version of Record
Download (741kB)

More information

Published date: 2004

Identifiers

Local EPrints ID: 22778
URI: http://eprints.soton.ac.uk/id/eprint/22778
ISSN: 1057-7157
PURE UUID: ff01bb38-845b-4c48-b3ea-d7676bc41ab2
ORCID for S.M. Spearing: ORCID iD orcid.org/0000-0002-3059-2014

Catalogue record

Date deposited: 13 Mar 2006
Last modified: 16 Mar 2024 03:37

Export record

Altmetrics

Contributors

Author: Y. Peles
Author: V.T. Srikar
Author: T.S. Harrison
Author: A. Mracek
Author: S.M. Spearing ORCID iD

Download statistics

Downloads from ePrints over the past year. Other digital versions may also be available to download e.g. from the publisher's website.

View more statistics

Atom RSS 1.0 RSS 2.0

Contact ePrints Soton: eprints@soton.ac.uk

ePrints Soton supports OAI 2.0 with a base URL of http://eprints.soton.ac.uk/cgi/oai2

This repository has been built using EPrints software, developed at the University of Southampton, but available to everyone to use.

We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we will assume that you are happy to receive cookies on the University of Southampton website.

×