Design of 50nm Vertical MOSFET Incorporating a Dielectric Pocket

Donaghy, D, Hall, S, de Groot, C H, Kunz, V D and Ashburn, P (2004) Design of 50nm Vertical MOSFET Incorporating a Dielectric Pocket IEEE Transactions on Electron Devices, 51, (1), pp. 158-161.


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A new architecture for a vertical MOS transistor is proposed that incorporates a so-calle dielectric pocket (DP) for suppression of short channel effects and bulk punch-through. We outline the advantages that the DP brings and propose a basic fabrication process to realize the device. The design issues of a 50-nm channel device are addressed by numerical simulation. The gate delay of an associated CMOS inverter is assessed in the context of the International Technology Roadmap for Semiconductors and the vertical transistor is seen to offer considerable advantages down to the 100-nm node and beyond due to the dual channels and the ability to produce a 50-nm channel legnth with more relaxed lithography.

Item Type: Article
Keywords: Dielectric pocket, short-channel effects, SCEs, Si devices vertical MOSFET
Organisations: Nanoelectronics and Nanotechnology
ePrint ID: 258918
Date :
Date Event
January 2004Published
Date Deposited: 27 Feb 2004
Last Modified: 17 Apr 2017 22:38
Further Information:Google Scholar

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