A three-dimensional electrostatic actuator with a locking mechanism for a new generation of atom chips
A three-dimensional electrostatic actuator with a locking mechanism for a new generation of atom chips
A micromachined three-dimensional electrostatic actuator that is optimized for aligning and tuning optical microcavities on atom chips is presented. The design of the 3D actuator is outlined in detail, and its characteristics are verified by analytical calculations and finite element modelling. Furthermore, the fabrication process of the actuation device is described and preliminary fabrication results are shown. The actuation in the chip plane which is used for mirror positioning has a working envelope of 17.5 ?m. The design incorporates a unique locking mechanism which allows the out-of-plane actuation that is used for cavity tuning to be carried out once the in-plane actuation is completed. A maximum translation of 7 ?m can be achieved in the out-of-plane direction.
90-5682-535-6
S39-S46
Gollasch, C O
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Moktadir, Zak
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Kraft, Michael
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Bagnall, Darren
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Trupke, M
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Eriksson, S
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Hinds, E A
cd7a9dc5-438d-401b-9ad8-fa3ff9b787ff
2004
Gollasch, C O
cf4d171f-2514-4982-a91f-931cc54bc793
Moktadir, Zak
2c4bc910-ec7b-40d0-8070-4fb45b173bcc
Kraft, Michael
54927621-738f-4d40-af56-a027f686b59f
Bagnall, Darren
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Trupke, M
ff10fac6-8b4b-4f1e-91ad-855c5f1a0113
Eriksson, S
6fd82ad3-19c6-40fa-8007-92f92c9e180f
Hinds, E A
cd7a9dc5-438d-401b-9ad8-fa3ff9b787ff
Gollasch, C O, Moktadir, Zak, Kraft, Michael, Bagnall, Darren, Trupke, M, Eriksson, S and Hinds, E A
(2004)
A three-dimensional electrostatic actuator with a locking mechanism for a new generation of atom chips.
Journal of Micromachanics and Microengineering, 15 (7), .
Abstract
A micromachined three-dimensional electrostatic actuator that is optimized for aligning and tuning optical microcavities on atom chips is presented. The design of the 3D actuator is outlined in detail, and its characteristics are verified by analytical calculations and finite element modelling. Furthermore, the fabrication process of the actuation device is described and preliminary fabrication results are shown. The actuation in the chip plane which is used for mirror positioning has a working envelope of 17.5 ?m. The design incorporates a unique locking mechanism which allows the out-of-plane actuation that is used for cavity tuning to be carried out once the in-plane actuation is completed. A maximum translation of 7 ?m can be achieved in the out-of-plane direction.
Text
jmmGollasch3DActuator.pdf
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More information
Published date: 2004
Additional Information:
Event Dates: 5 - 7 September 2004
Venue - Dates:
15th MicroMechanics Europe Workshop, , Leuven, Belgium, 2004-09-05 - 2004-09-07
Organisations:
Nanoelectronics and Nanotechnology
Identifiers
Local EPrints ID: 262405
URI: http://eprints.soton.ac.uk/id/eprint/262405
ISBN: 90-5682-535-6
PURE UUID: b3f198fa-a1c5-43ca-bf25-c78bd89fff7a
Catalogue record
Date deposited: 26 Apr 2006
Last modified: 14 Mar 2024 07:11
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Contributors
Author:
C O Gollasch
Author:
Zak Moktadir
Author:
Michael Kraft
Author:
Darren Bagnall
Author:
M Trupke
Author:
S Eriksson
Author:
E A Hinds
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