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Analysis of Noise Coupling From a Power Distribution Network to Signal Traces in High-Speed Multilayer Printed Circuit Boards

Analysis of Noise Coupling From a Power Distribution Network to Signal Traces in High-Speed Multilayer Printed Circuit Boards
Analysis of Noise Coupling From a Power Distribution Network to Signal Traces in High-Speed Multilayer Printed Circuit Boards
As layout density increases in highly integrated multilayer printed circuit boards (PCBs), the noise that exists in the power distribution network (PDN) is increasingly coupled to the signal traces, and precise modeling to describe the coupling phenomenon becomes necessary. This paper presents a model to describe noise coupling between the power/ground planes and signal traces in multilayer systems. An analytical model for the coupling has been successfully derived, and the coupling mechanism was rigorously analyzed and clarified. Wave equations for a signal trace with power/ground noise were solved by imposing boundary conditions. Measurements in both the frequency and time domains have been conducted to confirm the validity of the proposed model.
Analytical modeling, coupling measurement, electromagnetic coupling, power distribution network (PDN), power/ground, scattering, switching noise.
0018-9375
319-330
Kim, Jingook
b7777628-1848-4576-a1b8-71cc5a7f1c76
Rotaru, Mihai D
c53c5038-2fed-4ace-8fad-9f95d4c95b7e
Baek, Seungyong
8e14ce7e-d914-4fe4-91ac-0c36cd50854c
Park, Jongbae
ff44326f-745b-4a54-8c0e-88c774b9754f
Iyer, Mahadevan K
081e7bde-dab4-4653-8853-d834bbfc0323
Kim, Joungho
4d202ba7-fbea-4426-a70f-cc89fecf85e2
Kim, Jingook
b7777628-1848-4576-a1b8-71cc5a7f1c76
Rotaru, Mihai D
c53c5038-2fed-4ace-8fad-9f95d4c95b7e
Baek, Seungyong
8e14ce7e-d914-4fe4-91ac-0c36cd50854c
Park, Jongbae
ff44326f-745b-4a54-8c0e-88c774b9754f
Iyer, Mahadevan K
081e7bde-dab4-4653-8853-d834bbfc0323
Kim, Joungho
4d202ba7-fbea-4426-a70f-cc89fecf85e2

Kim, Jingook, Rotaru, Mihai D, Baek, Seungyong, Park, Jongbae, Iyer, Mahadevan K and Kim, Joungho (2006) Analysis of Noise Coupling From a Power Distribution Network to Signal Traces in High-Speed Multilayer Printed Circuit Boards. IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 48 (2), 319-330.

Record type: Article

Abstract

As layout density increases in highly integrated multilayer printed circuit boards (PCBs), the noise that exists in the power distribution network (PDN) is increasingly coupled to the signal traces, and precise modeling to describe the coupling phenomenon becomes necessary. This paper presents a model to describe noise coupling between the power/ground planes and signal traces in multilayer systems. An analytical model for the coupling has been successfully derived, and the coupling mechanism was rigorously analyzed and clarified. Wave equations for a signal trace with power/ground noise were solved by imposing boundary conditions. Measurements in both the frequency and time domains have been conducted to confirm the validity of the proposed model.

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More information

Published date: May 2006
Keywords: Analytical modeling, coupling measurement, electromagnetic coupling, power distribution network (PDN), power/ground, scattering, switching noise.
Organisations: EEE

Identifiers

Local EPrints ID: 264156
URI: http://eprints.soton.ac.uk/id/eprint/264156
ISSN: 0018-9375
PURE UUID: 401f4e6d-8085-41a2-b373-10106dd7a0aa

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Date deposited: 11 Jun 2007
Last modified: 14 Mar 2024 07:43

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Contributors

Author: Jingook Kim
Author: Mihai D Rotaru
Author: Seungyong Baek
Author: Jongbae Park
Author: Mahadevan K Iyer
Author: Joungho Kim

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