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High Quality Schottky Contacts for Limiting Leakage Currents in Ge Based Schottky Barrier MOSFETs

Record type: Article

Schottky barrier (SB) Ge channel MOSFETs suffer from high drain-body leakage at the required elevated substrate doping concentrations to suppress source-drain leakage. Here we show that electrodeposited Ni-Ge and NiGe/Ge Schottky diodes on highly doped Ge show low off current, which might make them suitable for SB p-MOSFETs. The Schottky diodes showed rectification of up to 5 orders in magnitude. At low forward biases the overlap of the forward current density curves for the as deposited Ni/n-Ge and NiGe/n-Ge Schottky diodes indicates Fermi-level pinning in the Ge band gap. The SB height for electrons remains virtually constant at 0.52 eV (indicating a hole barrier height of 0.14 eV) under various annealing temperatures. The series resistance decreases with increasing annealing temperature in agreement with four point probe measurements indicating the lower specific resistance of NiGe as compared to Ni, which is crucial for high drive current in SB p-MOSFETs. We show by numerical simulation that by incorporating such high quality Schottky diodes in the source/drain of a Ge channel PMOS, highly doped substrate could be used to minimize the subthreshold source to drain leakage current.

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Citation

Husain, M. K., Li, X. and de Groot, C. H. (2009) High Quality Schottky Contacts for Limiting Leakage Currents in Ge Based Schottky Barrier MOSFETs IEEE Transactions on Electron Devices, 56, (3), pp. 499-504.

More information

Published date: March 2009
Organisations: Nanoelectronics and Nanotechnology

Identifiers

Local EPrints ID: 266961
URI: http://eprints.soton.ac.uk/id/eprint/266961
PURE UUID: f08aa970-14e6-4735-988a-e3399bedfb0d
ORCID for C. H. de Groot: ORCID iD orcid.org/0000-0002-3850-7101

Catalogue record

Date deposited: 02 Dec 2008 20:22
Last modified: 24 Jul 2017 16:41

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Contributors

Author: M. K. Husain
Author: X. Li
Author: C. H. de Groot ORCID iD

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