A full wafer dicing free dry release process for MEMS devices

Sari, Ibrahim, Zeimpekis, Ioannis and Kraft, Michael (2010) A full wafer dicing free dry release process for MEMS devices. pp. 850-853 . (doi:10.1016/j.proeng.2010.09.242).

Record type: Conference or Workshop Item (Paper)

Abstract

This paper presents a full wafer, dicing free, dry release process using hydrofluoric acid (HF) vapour phase etching (VPE) for MEMS sensors and actuators fabricated using silicon on insulator (SOI) wafers. It is particularly beneficial to MEMS sensors whose performance benefits from a large proof mass, for example accelerometers and gyroscopes. Such a fabrication method was first proposed by Overstolz et al. where the wafer level release steps for a tilting platform measuring 2×2 mm² were presented Overstolz et al. (2004) . In the work described here, the process is extended to the full wafer release of an accelerometer with a large proof mass measuring 4×7 mm². The sensor was successfully fabricated with a yield of over 95%.

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