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A full wafer dicing free dry release process for MEMS devices

A full wafer dicing free dry release process for MEMS devices
A full wafer dicing free dry release process for MEMS devices
850-853
Sari, Ibrahim
cdcb1265-4a94-4c5a-b8b1-f1ca7e6759d7
Zeimpekis, Ioannis
a2c354ec-3891-497c-adac-89b3a5d96af0
Kraft, Michael
c2ff2439-b909-4af3-824d-9d7c0d14dc3e
Sari, Ibrahim
cdcb1265-4a94-4c5a-b8b1-f1ca7e6759d7
Zeimpekis, Ioannis
a2c354ec-3891-497c-adac-89b3a5d96af0
Kraft, Michael
c2ff2439-b909-4af3-824d-9d7c0d14dc3e

Sari, Ibrahim, Zeimpekis, Ioannis and Kraft, Michael (2010) A full wafer dicing free dry release process for MEMS devices. pp. 850-853 .

Record type: Conference or Workshop Item (Paper)

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More information

Published date: 1 September 2010
Organisations: NANO

Identifiers

Local EPrints ID: 409584
URI: http://eprints.soton.ac.uk/id/eprint/409584
PURE UUID: 0c7a4a95-dd16-4e4c-ace8-21681ac5b130

Catalogue record

Date deposited: 31 May 2017 04:01
Last modified: 09 Nov 2021 11:14

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Contributors

Author: Ibrahim Sari
Author: Michael Kraft

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