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Novel electronic packaging method for functional electronic textiles

Novel electronic packaging method for functional electronic textiles
Novel electronic packaging method for functional electronic textiles
A novel packaging method that enables the reliable mounting and protection of bare die within a textile yarn has been investigated. The reliability of electronic textiles is highly challenging given the flexibility of the fabric and the rigors of typical applications. Achieving reliable operation requires novel packaging approaches. In order to maximize the reliability and to minimize stresses in the electronic package, the die should be located as close as possible to the central axis of the overall assembly. The die is bonded to a bottom Kapton substrate that contains patterned conductive interconnects and bond pads forming the functional circuit. The circuit is protected by a molded Kapton film that has recesses formed where the die is located. This approach has been compared with three other traditional packaging technologies during washing, twisting, and cyclical bending tests. The novel electronic packaging method shows the best performance in all tests surviving up to 45 wash cycles.
2156-3950
216-225
Li, Menglong
23dd02ab-027d-46ca-a8eb-ac9b73f3916f
Tudor, John
46eea408-2246-4aa0-8b44-86169ed601ff
Liu, Jingqi
68b025ba-d643-40bc-848d-09aaff4a492f
Torah, Russel
7147b47b-db01-4124-95dc-90d6a9842688
Komolafe, Abiodun
5e79fbab-38be-4a64-94d5-867a94690932
Beeby, Steve
ba565001-2812-4300-89f1-fe5a437ecb0d
Li, Menglong
23dd02ab-027d-46ca-a8eb-ac9b73f3916f
Tudor, John
46eea408-2246-4aa0-8b44-86169ed601ff
Liu, Jingqi
68b025ba-d643-40bc-848d-09aaff4a492f
Torah, Russel
7147b47b-db01-4124-95dc-90d6a9842688
Komolafe, Abiodun
5e79fbab-38be-4a64-94d5-867a94690932
Beeby, Steve
ba565001-2812-4300-89f1-fe5a437ecb0d

Li, Menglong, Tudor, John, Liu, Jingqi, Torah, Russel, Komolafe, Abiodun and Beeby, Steve (2019) Novel electronic packaging method for functional electronic textiles. IEEE Transactions on Components Packaging and Manufacturing Technology, 9 (2), 216-225. (doi:10.1109/TCPMT.2019.2892404).

Record type: Article

Abstract

A novel packaging method that enables the reliable mounting and protection of bare die within a textile yarn has been investigated. The reliability of electronic textiles is highly challenging given the flexibility of the fabric and the rigors of typical applications. Achieving reliable operation requires novel packaging approaches. In order to maximize the reliability and to minimize stresses in the electronic package, the die should be located as close as possible to the central axis of the overall assembly. The die is bonded to a bottom Kapton substrate that contains patterned conductive interconnects and bond pads forming the functional circuit. The circuit is protected by a molded Kapton film that has recesses formed where the die is located. This approach has been compared with three other traditional packaging technologies during washing, twisting, and cyclical bending tests. The novel electronic packaging method shows the best performance in all tests surviving up to 45 wash cycles.

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More information

Submitted date: 2018
Accepted/In Press date: 29 December 2018
e-pub ahead of print date: 11 January 2019
Published date: February 2019

Identifiers

Local EPrints ID: 425545
URI: https://eprints.soton.ac.uk/id/eprint/425545
ISSN: 2156-3950
PURE UUID: 6cc75ef5-b90f-4c46-a094-378fb679f384
ORCID for Russel Torah: ORCID iD orcid.org/0000-0002-5598-2860
ORCID for Steve Beeby: ORCID iD orcid.org/0000-0002-0800-1759

Catalogue record

Date deposited: 24 Oct 2018 16:30
Last modified: 22 Oct 2019 00:55

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