Li, Menglong, Tudor, John, Liu, Jingqi, Torah, Russel, Komolafe, Abiodun and Beeby, Steve (2019) Novel electronic packaging method for functional electronic textiles. IEEE Transactions on Components Packaging and Manufacturing Technology, 9 (2), 216-225. (doi:10.1109/TCPMT.2019.2892404).
Abstract
A novel packaging method that enables the reliable mounting and protection of bare die within a textile yarn has been investigated. The reliability of electronic textiles is highly challenging given the flexibility of the fabric and the rigors of typical applications. Achieving reliable operation requires novel packaging approaches. In order to maximize the reliability and to minimize stresses in the electronic package, the die should be located as close as possible to the central axis of the overall assembly. The die is bonded to a bottom Kapton substrate that contains patterned conductive interconnects and bond pads forming the functional circuit. The circuit is protected by a molded Kapton film that has recesses formed where the die is located. This approach has been compared with three other traditional packaging technologies during washing, twisting, and cyclical bending tests. The novel electronic packaging method shows the best performance in all tests surviving up to 45 wash cycles.
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- Faculties (pre 2018 reorg) > Faculty of Physical Sciences and Engineering (pre 2018 reorg) > Electronics & Computer Science (pre 2018 reorg)
Current Faculties > Faculty of Engineering and Physical Sciences > School of Electronics and Computer Science > Electronics & Computer Science (pre 2018 reorg)
School of Electronics and Computer Science > Electronics & Computer Science (pre 2018 reorg) - Current Faculties > Faculty of Engineering and Physical Sciences > School of Electronics and Computer Science > Smart Electronic Materials & Systems
School of Electronics and Computer Science > Smart Electronic Materials & Systems
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