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Cost-effective 3D integration using inductive coupling links: Can we make stacking silicon as easy as stacking Lego?

Cost-effective 3D integration using inductive coupling links: Can we make stacking silicon as easy as stacking Lego?
Cost-effective 3D integration using inductive coupling links: Can we make stacking silicon as easy as stacking Lego?
3D-IC, Inductive, Coupling, Inductor, VLSI
Fletcher, Benjamin, James
b9ee2f3f-f125-47df-a73e-e61c0404d4c9
Das, Shidhartha
c1e693af-261c-495d-8f0f-227396df0e3b
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53
Fletcher, Benjamin, James
b9ee2f3f-f125-47df-a73e-e61c0404d4c9
Das, Shidhartha
c1e693af-261c-495d-8f0f-227396df0e3b
Mak, Terrence
0f90ac88-f035-4f92-a62a-7eb92406ea53

Fletcher, Benjamin, James, Das, Shidhartha and Mak, Terrence (2018) Cost-effective 3D integration using inductive coupling links: Can we make stacking silicon as easy as stacking Lego? Arm Research Summit 2018, Robinson College, United Kingdom. 17 - 19 Sep 2018.

Record type: Conference or Workshop Item (Poster)
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Cost-Effective 3D Integration Using Inductive Coupling Links - Version of Record
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More information

Published date: 18 September 2018
Venue - Dates: Arm Research Summit 2018, Robinson College, United Kingdom, 2018-09-17 - 2018-09-19
Keywords: 3D-IC, Inductive, Coupling, Inductor, VLSI

Identifiers

Local EPrints ID: 427019
URI: http://eprints.soton.ac.uk/id/eprint/427019
PURE UUID: 942d5d68-1cd8-4ce5-90a2-50a907acc783
ORCID for Benjamin, James Fletcher: ORCID iD orcid.org/0000-0002-4957-1934

Catalogue record

Date deposited: 20 Dec 2018 17:30
Last modified: 30 Jan 2020 01:44

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Contributors

Author: Benjamin, James Fletcher ORCID iD
Author: Shidhartha Das
Author: Terrence Mak

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