Integrating flexible filament circuits for e‐textile applications

Abstract

Practical wearable e‐textiles must be durable and retain, as far as possible, the textile properties such as drape, feel, lightweight, breathability, and washability that make fabrics suitable for clothing. Early e‐textile garments were realized by inserting standard portable electronic devices into bespoke pockets and arranging interconnects and cabling across the garment. In these examples, the textile merely served as a vehicle to house the electronics and had no inherent electronic functionality. A reduction in electronic component size, the development of flexible circuits, and the ability to weave robust interconnects offer the potential for improved levels of electronic integration within the textile. The weaving of electronic circuit filaments less than 2 mm wide into fabrics such that the electronics are fully concealed in the textile and given extra protection by the surrounding textile fibers is introduced. The failure mechanisms for different filament circuit designs before and after integration into the textile are investigated with a 90° cyclical bending test. Results show that encapsulated filament circuits embedded within the textile survive 45 washing cycles and more than 1500 cycles of 90° bending around a bending radius of 10 mm, performing five times better than equivalent filament circuits before integration into the fabric.

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Identifiers

ORCID for Abiodun Komolafe: orcid.org/0000-0002-3618-2390

ORCID for Russel Torah: orcid.org/0000-0002-5598-2860

ORCID for Yang Wei: orcid.org/0000-0001-6195-8595

ORCID for Michael Tudor: orcid.org/0000-0003-1179-9455

ORCID for Stephen Beeby: orcid.org/0000-0002-0800-1759

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