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Microstructural evolution and mechanical behavior of Cu/Nb multilayer composites processed by accumulative roll bonding

Microstructural evolution and mechanical behavior of Cu/Nb multilayer composites processed by accumulative roll bonding
Microstructural evolution and mechanical behavior of Cu/Nb multilayer composites processed by accumulative roll bonding
Cu/Nb multilayer composites with minimum individual layer thicknesses of ~2.8 μm were achieved by accumulative roll bonding (ARB). The microstructural evolution and mechanical properties of these composites were investigated with different layer thicknesses after ARB processing. The results show that there is no visible interfacial reaction between the Cu and Nb layers and the kernel average misorientation (KAM) distributions in electron backscattered diffraction (EBSD) maps remain in steady-state during the ARB cycles of 3 to 7. The tensile testing results demonstrate that the yield strength increases with decreasing layer thickness in Cu/Nb multilayer composites. A simultaneous increase of strength and elongation was achieved by regulating the laminated structures. Microstructure and fracture analysis indicate that the simultaneous increase of strength and elongation is attributed to the high density of bimetal interfaces which act as a barrier for dislocations mobility and crack propagation.
Cu/Nb multilayer composites, accumulative roll bonding, fracture, mechanical properties, microstructure
1438-1656
1-12
Ding, Chaogang
2edf8082-909e-4bec-a2b3-3b34943f5803
Xu, Jie
ff6d4656-c15b-45a4-bd71-d45937ec38fc
Li, Xuewen
bfd1bf00-2883-4891-ac91-89afc2973f15
Shan, Debin
fd8652eb-1eeb-4ae2-bcc4-102320f3c2d7
Guo, Bin
4c18c2f2-4b7f-4ac8-8fa1-51b580fab4c8
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
Ding, Chaogang
2edf8082-909e-4bec-a2b3-3b34943f5803
Xu, Jie
ff6d4656-c15b-45a4-bd71-d45937ec38fc
Li, Xuewen
bfd1bf00-2883-4891-ac91-89afc2973f15
Shan, Debin
fd8652eb-1eeb-4ae2-bcc4-102320f3c2d7
Guo, Bin
4c18c2f2-4b7f-4ac8-8fa1-51b580fab4c8
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86

Ding, Chaogang, Xu, Jie, Li, Xuewen, Shan, Debin, Guo, Bin and Langdon, Terence G. (2020) Microstructural evolution and mechanical behavior of Cu/Nb multilayer composites processed by accumulative roll bonding. Advanced Engineering Materials, 22 (1), 1-12, [1900702]. (doi:10.1002/adem.201900702).

Record type: Article

Abstract

Cu/Nb multilayer composites with minimum individual layer thicknesses of ~2.8 μm were achieved by accumulative roll bonding (ARB). The microstructural evolution and mechanical properties of these composites were investigated with different layer thicknesses after ARB processing. The results show that there is no visible interfacial reaction between the Cu and Nb layers and the kernel average misorientation (KAM) distributions in electron backscattered diffraction (EBSD) maps remain in steady-state during the ARB cycles of 3 to 7. The tensile testing results demonstrate that the yield strength increases with decreasing layer thickness in Cu/Nb multilayer composites. A simultaneous increase of strength and elongation was achieved by regulating the laminated structures. Microstructure and fracture analysis indicate that the simultaneous increase of strength and elongation is attributed to the high density of bimetal interfaces which act as a barrier for dislocations mobility and crack propagation.

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JX-AEM-birthday - Accepted Manuscript
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More information

Accepted/In Press date: 18 November 2019
e-pub ahead of print date: 21 November 2019
Published date: January 2020
Additional Information: Special Issue: Dedicated to Terence G. Langdon on the Occasion of his 80th Birthday
Keywords: Cu/Nb multilayer composites, accumulative roll bonding, fracture, mechanical properties, microstructure

Identifiers

Local EPrints ID: 435934
URI: http://eprints.soton.ac.uk/id/eprint/435934
ISSN: 1438-1656
PURE UUID: 2540724d-250e-4d58-b488-dc2a55ce42d7
ORCID for Terence G. Langdon: ORCID iD orcid.org/0000-0003-3541-9250

Catalogue record

Date deposited: 25 Nov 2019 17:30
Last modified: 26 Nov 2021 05:55

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Contributors

Author: Chaogang Ding
Author: Jie Xu
Author: Xuewen Li
Author: Debin Shan
Author: Bin Guo

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