Stoichiometry and molecular dynamics of anhydride-cured epoxy resin incorporating octa-glycidyl POSS Co-Monomer
Stoichiometry and molecular dynamics of anhydride-cured epoxy resin incorporating octa-glycidyl POSS Co-Monomer
The influence of octa-glycidyl (OG) cubic silsesquioxane and reaction stoichiometry (stoichiometry factor, SF) on the cure chemistry and molecular dynamics of an anhydride-cured epoxy resin is reported. Fourier transform infrared spectroscopy revealed that an excess of epoxide groups suppresses esterification, as does the substitution of the epoxy pre-polymer with OG. Suppressed glass transition temperature (T
g) is reported for any given SF on addition of OG; these results are supported by the dielectric α relaxation behaviour. System-to-system network variations arising from changes in the degree of esterification and etherification are not sufficient to form discrete dielectric β processes. Finally, we propose a generic interpretation for the γ dielectric relaxation involving both competing origins reported in the literature, namely γ
1 (local motions of main-chain segments) and γ
2 (unreacted moieties). These attributions explain the observed dielectric features and relate these to the chemical composition of each system.
Anhydride, Epoxy stoichiometry, Molecular dynamics, OG POSS
Vryonis, Orestis
4affde05-88f2-436f-b036-dceedf31ea9c
Riarh, Satpreet
079407c8-7920-4d99-acb4-05ed8d8b03a6
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Vaughan, Alun
6d813b66-17f9-4864-9763-25a6d659d8a3
20 January 2021
Vryonis, Orestis
4affde05-88f2-436f-b036-dceedf31ea9c
Riarh, Satpreet
079407c8-7920-4d99-acb4-05ed8d8b03a6
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Vaughan, Alun
6d813b66-17f9-4864-9763-25a6d659d8a3
Vryonis, Orestis, Riarh, Satpreet, Andritsch, Thomas and Vaughan, Alun
(2021)
Stoichiometry and molecular dynamics of anhydride-cured epoxy resin incorporating octa-glycidyl POSS Co-Monomer.
Polymer, 213, [123312].
(doi:10.1016/j.polymer.2020.123312).
Abstract
The influence of octa-glycidyl (OG) cubic silsesquioxane and reaction stoichiometry (stoichiometry factor, SF) on the cure chemistry and molecular dynamics of an anhydride-cured epoxy resin is reported. Fourier transform infrared spectroscopy revealed that an excess of epoxide groups suppresses esterification, as does the substitution of the epoxy pre-polymer with OG. Suppressed glass transition temperature (T
g) is reported for any given SF on addition of OG; these results are supported by the dielectric α relaxation behaviour. System-to-system network variations arising from changes in the degree of esterification and etherification are not sufficient to form discrete dielectric β processes. Finally, we propose a generic interpretation for the γ dielectric relaxation involving both competing origins reported in the literature, namely γ
1 (local motions of main-chain segments) and γ
2 (unreacted moieties). These attributions explain the observed dielectric features and relate these to the chemical composition of each system.
Text
Polymer_1210_OV_Accepted
- Accepted Manuscript
More information
Accepted/In Press date: 10 December 2020
e-pub ahead of print date: 11 December 2020
Published date: 20 January 2021
Keywords:
Anhydride, Epoxy stoichiometry, Molecular dynamics, OG POSS
Identifiers
Local EPrints ID: 446570
URI: http://eprints.soton.ac.uk/id/eprint/446570
ISSN: 0032-3861
PURE UUID: ecaf1ddb-5d25-488a-86a8-080ab6a3b0bb
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Date deposited: 15 Feb 2021 17:31
Last modified: 17 Mar 2024 06:10
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