Grain size tailoring to control strain hardening and improve the mechanical properties of a CoCrFeNiMn high-entropy alloy
Grain size tailoring to control strain hardening and improve the mechanical properties of a CoCrFeNiMn high-entropy alloy
An equiatomic CoCrFeNiMn high-entropy alloy was processed by severe plastic deformation followed by post-deformation annealing over a range of temperatures and times leading to a wide range of grain sizes from ~0.05 to ~70 μm. The results demonstrate there is a sharp evolution in grain size and hardness after annealing above 800 °C due to coarsening facilitated by the dissolution of precipitates together with a high rate of diffusion at high temperatures. Grain growth behavior revealed an incremental low value grain growth exponent with increasing annealing temperature together with a high value activation energy for grain growth of ~440 kJ mol-1. A critical grain size of ~2 µm is proposed in which deformation-induced twinning is suppressed during plastic deformation. Nevertheless, slip and deformation-induced twinning are deformation mechanisms occurring in samples with grain sizes above this critical value. A model is presented for engineering the grain size by controlling the annealing parameters in the fine grain size range to benefit from the advantages of deformation-induced twining in the CoCrFeNiMn alloy.
Deformation-induced twinning, Grain refinement, High-entropy alloy, Microstructure engineering, thermomechanical treatment
Shahmir, Hamed
6914819d-f654-4928-a445-9ac0d3abedcf
Sajad Mehranpour, Mohammad
ef690c1f-b2b0-4440-a987-f76d41019f9a
Amir Arsalan Shams, Seyed
8065359a-284f-47ce-80dd-3707909c973d
Soo Lee, Chong
b6cffd66-c872-4f67-a3f6-8379e31d3653
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
Shahmir, Hamed
6914819d-f654-4928-a445-9ac0d3abedcf
Sajad Mehranpour, Mohammad
ef690c1f-b2b0-4440-a987-f76d41019f9a
Amir Arsalan Shams, Seyed
8065359a-284f-47ce-80dd-3707909c973d
Soo Lee, Chong
b6cffd66-c872-4f67-a3f6-8379e31d3653
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
Shahmir, Hamed, Sajad Mehranpour, Mohammad, Amir Arsalan Shams, Seyed, Soo Lee, Chong and Langdon, Terence G.
(2022)
Grain size tailoring to control strain hardening and improve the mechanical properties of a CoCrFeNiMn high-entropy alloy.
High Entropy Alloys and Materials.
(doi:10.1007/s44210-022-00003-7).
Abstract
An equiatomic CoCrFeNiMn high-entropy alloy was processed by severe plastic deformation followed by post-deformation annealing over a range of temperatures and times leading to a wide range of grain sizes from ~0.05 to ~70 μm. The results demonstrate there is a sharp evolution in grain size and hardness after annealing above 800 °C due to coarsening facilitated by the dissolution of precipitates together with a high rate of diffusion at high temperatures. Grain growth behavior revealed an incremental low value grain growth exponent with increasing annealing temperature together with a high value activation energy for grain growth of ~440 kJ mol-1. A critical grain size of ~2 µm is proposed in which deformation-induced twinning is suppressed during plastic deformation. Nevertheless, slip and deformation-induced twinning are deformation mechanisms occurring in samples with grain sizes above this critical value. A model is presented for engineering the grain size by controlling the annealing parameters in the fine grain size range to benefit from the advantages of deformation-induced twining in the CoCrFeNiMn alloy.
Text
Hamed-HEA
- Accepted Manuscript
More information
Accepted/In Press date: 19 July 2022
e-pub ahead of print date: 19 August 2022
Keywords:
Deformation-induced twinning, Grain refinement, High-entropy alloy, Microstructure engineering, thermomechanical treatment
Identifiers
Local EPrints ID: 469822
URI: http://eprints.soton.ac.uk/id/eprint/469822
PURE UUID: 8b946bed-8a22-47e3-8219-b7a3e3978263
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Date deposited: 27 Sep 2022 16:30
Last modified: 17 Mar 2024 07:29
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Author:
Hamed Shahmir
Author:
Mohammad Sajad Mehranpour
Author:
Seyed Amir Arsalan Shams
Author:
Chong Soo Lee
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